# US 2014/0151091 A1 · Primer layer for plating process, laminate for circuit board and production method for same, and multilayer circuit board and production method for same

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- Number: US 2014/0151091 A1
- Document ID: US20140151091A1
- Status: Published application
- Kind: A1
- Application number: 14/123,140
- Filed: 2012-05-29
- Published: 2014-06-05
- Earliest claimed: 2011-05-31
- Inventors: Daisuke Fujimoto; Kunpei Yamada; Nobuyuki Ogawa; Hikari Murai
- Web page: https://patentgrep.com/patent/US20140151091A1

## CPC

- H05K 1/0366: {reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence)}
- C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C09D 5/002: {Priming paints (C09D5/08 takes precedence)}
- C23C 18/1653: {Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating}
- C23C 18/1844: {with use of organic or inorganic compounds other than metals, first}
- C25D 5/34: Pretreatment of metallic surfaces to be electroplated
- C25D 7/0614: {Strips or foils}
- H05K 1/0298: {Multilayer circuits}
- H05K 3/007: {Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence)}
- H05K 3/4676: {Single layer compositions}
- H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)}
- H05K 2201/0209: Inorganic, non-metallic particles
- Y10T 156/1043: Subsequent to assembly
- Y10T 428/249921: Web or sheet containing structurally defined element or component
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Disclosed are a primer layer for plating process exhibiting high adhesiveness to an electroless copper plating and capable of coping with high density of wirings of semiconductor packages; a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the primer layer and a method for manufacture thereof. Specifically disclosed are a primer layer for plating process formed of a resin composition for primer layer including (A) a polyfunctional epoxy resin, (B) an epoxy resin curing agent, and (C) a phenolic hydroxyl group-containing polybutadiene-modified polyamide resin having specified structural units, wherein a blending proportion of the component (C) is 5 parts by mass or more and less than 25 parts by mass based on 100 parts by mass of a total sum of the component (A) and the component (B); a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the primer layer and a method for manufacture thereof.

## Claims

### Claim 1

A primer layer for plating process formed of a resin composition for primer layer comprising (A) a polyfunctional epoxy resin, (B) an epoxy resin curing agent, and (C) a phenolic hydroxyl group-containing polybutadiene-modified polyamide resin having structural units represented by the following formulae (i), (ii) and (iii), wherein a blending proportion of the phenolic hydroxyl group-containing polybutadiene-modified polyamide resin (C) in the resin composition for primer layer is 5 parts by mass or more and less than 25 parts by mass based on 100 parts by mass of a total sum of the polyfunctional epoxy resin (A) and the epoxy resin curing agent (B):
wherein
each of a, b, c, x, y, and z represents an average degree of polymerization; a represents an integer of from 2 to 10; b represents an integer of from 0 to 3; c represents an integer of from 3 to 30; when x is 1, then (y+z) represents an integer of from 2 to 300; when y is 1, then z is 20 or more; each of R, R′, and R″ independently represents a divalent group derived from an aromatic diamine or an aliphatic diamine; and each R′″ independently represents a divalent group derived from an aromatic dicarboxylic acid, an aliphatic dicarboxylic acid, or an oligomer having a carboxyl group at both ends thereof.

### Claim 2 (depends on 1)

The primer layer for plating process according to claim 1, having a thickness of from 1 to 10 μm.

### Claim 3 (depends on 1)

The primer layer for plating process according to claim 1, wherein the polyfunctional epoxy resin (A) contained in the resin composition for primer layer includes an aralkyl type epoxy resin having a biphenyl structure.

### Claim 4 (depends on 1)

The primer layer for plating process according to claim 1, wherein the resin composition for primer layer contains (D) an inorganic filler having an average primary particle diameter of not more than 100 nm.

### Claim 5 (depends on 4)

The primer layer for plating process according to claim 4, wherein the inorganic filler (D) is fumed silica.

### Claim 6 (depends on 4)

The primer layer for plating process according to claim 4, wherein the inorganic filler (D) is subjected to a surface treatment.

### Claim 7 (depends on 1)

The primer layer for plating process according to claim 1, wherein a surface roughness (Ra) of the primer layer for plating process after a roughening treatment is not more than 0.4 μm.

### Claim 8 (depends on 1)

A laminate for wiring board provided with a primer layer for plating process, which is obtained by superimposing a primer layer-provided support film having the primer layer for plating process according to claim 1 on a support film, on both surfaces of a prepreg for wiring board such that the primer layer for plating process is located inside; further superimposing a mirror board on the outside thereof; press molding them; and after molding, removing the support film.

### Claim 9 (depends on 1)

A method for manufacture of a laminate for wiring board provided with a primer layer for plating process, comprising superimposing a primer layer-provided support film having the primer layer for plating process according to claim 1 on a support film, on both surfaces of a prepreg for wiring board such that the primer layer for plating process is located inside; further superimposing a mirror board on the outside thereof; press molding them; and after molding, removing the support film.

### Claim 10 (depends on 1)

A laminate for wiring board provided with a primer layer for plating process, which is obtained by superimposing a primer layer-provided support film having the primer layer for plating process according to claim 1 on a support film, on both surfaces of a prepreg for wiring board such that the primer layer for plating process is located inside; laminating them by heating and applying a pressure by a laminator using a heat-resistant rubber sheet; after lamination, curing the laminate by heating; and removing the support film.

### Claim 11 (depends on 1)

A method for manufacture of a laminate for wiring board provided with a primer layer for plating process, comprising superimposing a primer layer-provided support film having the primer layer for plating process according to claim 1 on a support film, on both surfaces of a prepreg for wiring board such that the primer layer for plating process is located inside; laminating them by heating and applying a pressure by a laminator using a heat-resistant rubber sheet; after lamination, curing the laminate by heating; and removing the support film.

### Claim 12 (depends on 1)

A multilayer wiring board provided with a primer layer for plating process, which is obtained by superimposing a primer layer-provided support film having the primer layer for plating process according to claim 1 on a support film, on a prepreg for wiring board such that the primer layer for plating process is located inside; superimposing the laminate on both surfaces of a circuit-processed wiring board; further superimposing a mirror board on the outside thereof; press molding them; and after molding, removing the support film.

### Claim 13 (depends on 1)

A method for manufacture of a multilayer wiring board provided with a primer layer for plating process, comprising superimposing a primer layer-provided support film having the primer layer for plating process according to claim 1 on a support film, on a prepreg for wiring board such that the primer layer for plating process is located inside; superimposing the laminate on both surfaces of a circuit-processed wiring board; further superimposing a mirror board on the outside thereof; press molding them; after molding, removing the support film; and successively applying a roughening treatment, an electroless plating treatment, and an electroplating treatment.

### Claim 14 (depends on 1)

A multilayer wiring board provided with a primer layer for plating process, which is obtained by superimposing a primer layer-provided support film having the primer layer for plating process according to claim 1 on a support film, on a prepreg for wiring board such that the primer layer for plating process is located inside; superimposing the laminate on both surfaces of a circuit-processed wiring board; laminating them by heating and applying a pressure by a laminator using a heat-resistant rubber sheet; after lamination, curing the laminate by heating; removing the support film; and successively applying a roughening treatment, an electroless plating treatment, and an electroplating treatment.

### Claim 15 (depends on 1)

A method for manufacture of a multilayer wiring board provided with a primer layer for plating process, comprising superimposing a primer layer-provided support film having the primer layer for plating process according to claim 1 on a support film, on a prepreg for wiring board such that the primer layer for plating process is located inside; superimposing the laminate on both surfaces of a circuit-processed wiring board; laminating them by heating and applying a pressure by a laminator using a heat-resistant rubber sheet; after lamination, curing the laminate by heating; removing the support film; and successively applying a roughening treatment, an electroless plating treatment, and an electroplating treatment.