# US 2014/0151090 A1 · Stress relief structure

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- Number: US 2014/0151090 A1
- Document ID: US20140151090A1
- Status: Published application
- Kind: A1
- Application number: 13/848,739
- Filed: 2013-03-22
- Published: 2014-06-05
- Earliest claimed: 2012-11-30
- Assignees: Industrial Technology Research Institute
- Applicants: Industrial Technology Research Institute
- Inventors: Jui-Hung Chien; Chiao-Ling Lung
- Web page: https://patentgrep.com/patent/US20140151090A1

## CPC

- H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion}
- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- H10W 72/07227: {involving guiding structures, e.g. spacers or supporting members}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/281: {Auxiliary members}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 428/12444: Embodying fibers interengaged or between layers [e.g., paper, etc.]
- Y10T 428/21: Circular sheet or circular blank
- Y10T 442/3024: Including elastic strand or strip
- Y10T 442/3041: Woven fabric comprises strips or ribbons only
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A stress relief structure is provided. The stress relief structure includes a stress relief body, at least one first stress relief base and at least one second stress relief base. The stress relief body has an upper surface and a lower surface opposite to each other. The first stress relief base is disposed on the upper surface of the stress relief body. The second stress relief base is disposed on the lower surface of the stress relief body. The at least one first stress relief base and the at least one second stress relief base are interlaced to each other.

## Claims

### Claim 1

A stress relief structure, comprising:
a stress relief body, having an upper surface and a lower surface opposite to each other;
at least one first stress relief base, disposed on the upper surface of the stress relief body; and
at least one second stress relief base, disposed on the lower surface of the stress relief body,
wherein the at least one first stress relief base and the at least one second stress relief base are interlaced to each other.

### Claim 2 (depends on 1)

The stress relief structure of claim 1, wherein when the at least one first stress relief base comprises a plurality of first stress relief bases, the first stress relief bases are interlaced to each other.

### Claim 3 (depends on 1)

The stress relief structure of claim 1, wherein when the at least one second stress relief base comprises a plurality of second stress relief bases, the second stress relief bases are interlaced to each other.

### Claim 4 (depends on 1)

The stress relief structure of claim 1, wherein the stress relief structure is disposed between an interposer and a die; the at least one first stress relief base is disposed between the stress relief body and the die; and the at least one second stress relief base is disposed between the stress relief body and the interposer.

### Claim 5 (depends on 4)

The stress relief structure of claim 4, wherein the interposer comprises:
a glass substrate; and
at least one through-glass via, disposed in the glass substrate.

### Claim 6 (depends on 5)

The stress relief structure of claim 5, wherein a coefficient of thermal expansion of the stress relief body is 80% to 120% of a coefficient of thermal expansion of the at least one through-glass via.

### Claim 7 (depends on 5)

The stress relief structure of claim 5, wherein coefficients of thermal expansion of the at least one first stress relief base and the at least one second stress relief base are 80% to 120% of a coefficient of thermal expansion of the at least one through-glass via.

### Claim 8 (depends on 5)

The stress relief structure of claim 5, wherein when the at least one through-glass via comprises a plurality of through-glass vias, at least one of stress relief structures is disposed in a circle with a circle center as a geometric center of a polygon composed of the through-glass vias as vertices, wherein the circle is inside the polygon.

### Claim 9 (depends on 8)

The stress relief structure of claim 8, wherein a radius of the circle is less than twice a radius of the at least one through-glass via.

### Claim 10 (depends on 5)

The stress relief structure of claim 5, wherein relationships among a radius R of the at least one through-glass via, a radius r of the stress relief body, a distance L between a center of the at least one through-glass via and a center of the stress relief body, a short-side length W1 of the at least one first stress relief base and a short-side length W2 of the at least one second stress relief base are defined by the following Formula 1 to Formula 3:
0.2R≦r Formula 1
0≦L≦4(R+r) Formula 2
0≦W1,W2≦8r Formula 3.

### Claim 11 (depends on 1)

The stress relief structure of claim 1, wherein a material of each of the stress relief body, the at least one first stress relief base and the at least one second stress relief base comprises an elastic material or a brittle material.

### Claim 12 (depends on 1)

The stress relief structure of claim 1, wherein a material of each of the stress relief body, the at least one first stress relief base and the at least one second stress relief base comprises a metal, a polymer, or a carbon-based material.

### Claim 13 (depends on 12)

The stress relief structure of claim 12, wherein the metal comprises copper-tungsten, iron, or an alloy thereof.

### Claim 14 (depends on 12)

The stress relief structure of claim 12, wherein the polymer comprises polyacetylene.

### Claim 15 (depends on 12)

The stress relief structure of claim 12, wherein the carbon-based material comprises an activated carbon, carbon fibers, or carbon nanotubes.

### Claim 16 (depends on 1)

The stress relief structure of claim 1, wherein a shape of each of the at least one first stress relief base and the at least one second stress relief base respectively comprises a rectangle, a circle, or a pointed shape.

### Claim 17 (depends on 1)

The stress relief structure of claim 1, wherein a shape of the stress relief body comprises a circle, a polygon, or a shape having a geometric center.