# US 2014/0151089 A1 · Printed circuit board and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0151089 A1 - Document ID: US20140151089A1 - Status: Published application - Kind: A1 - Application number: 13/826,771 - Filed: 2013-03-14 - Published: 2014-06-05 - Earliest claimed: 2012-12-04 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Woon Chul CHOI; Hwan Soo Lee; Hye Yeon Cha - Web page: https://patentgrep.com/patent/US20140151089A1 ## CPC - G03F 7/34: Imagewise removal by selective transfer, e.g. peeling away - H05K 1/0221: {Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines} - H05K 3/28: Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} - H05K 3/281: {by means of a preformed insulating foil (H05K3/284 takes precedence)} - H05K 3/3452: Solder masks - H05K 2203/0537: Transfer of pre-fabricated insulating pattern - H05K 2203/0594: Insulating resist or coating with special shaped edges - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract Disclosed herein are a printed circuit board, including: a substrate having a patterned circuit layer on one surface thereof; and a resist pattern having a pattern corresponding to the circuit layer and covering the circuit layer so as to close the circuit layer, wherein a width of the resist pattern covering an upper portion of the circuit layer is the same as that of the resist pattern covering a lower portion of the circuit layer, and a method for manufacturing the same. ## Claims ### Claim 1 A printed circuit board, comprising: a substrate having a patterned circuit layer on one surface thereof; and a resist pattern having a pattern corresponding to the circuit layer and covering the circuit layer so as to close the circuit layer, wherein a width of the resist pattern covering an upper portion of the circuit layer is the same as that of the resist pattern covering a lower portion of the circuit layer. ### Claim 2 A method for manufacturing a printed circuit board, the method comprising: preparing an insulating film in which a resist layer having a predetermined thickness is applied onto an upper surface of a base substrate; patterning the resist layer according to a predetermined pattern to form a resist pattern; preparing a substrate having a circuit layer formed thereon, disposing the resist pattern and the circuit layer so as to face each other, and then adhering the insulating film and the substrate to each other; and separating the base substrate from the resist pattern. ### Claim 3 (depends on 2) The method according to claim 2, wherein the insulating film is a dry film. ### Claim 4 (depends on 2) The method according to claim 2, wherein the patterning is performed through a photolithography process. ### Claim 5 (depends on 4) The method according to claim 4, wherein the resist layer is semi-cured through a photocurable process at the time of exposure during the photolithography process. ### Claim 6 (depends on 2) The method according to claim 2, wherein the resist pattern corresponds to a pattern of the circuit layer. ### Claim 7 (depends on 2) The method according to claim 2, wherein after the separating, the resist pattern is completely cured through a thermosetting process. ### Claim 8 (depends on 2) The method according to claim 2, wherein the thickness of the resist layer is thicker than that of the circuit layer. ### Claim 9 A method for manufacturing a printed circuit board, the method comprising: preparing an insulating film in which a resist layer having a predetermined thickness is applied onto an upper surface of a base substrate and processing a reference hole in a specific position of the insulating film; patterning the resist layer according to a predetermined pattern to form a resist pattern; preparing a substrate having a reference pin formed in a position corresponding to the reference hole and a circuit layer, disposing the resist pattern and the circuit layer so as to face each other, and then adhering the insulating film and the substrate to each other by coinciding the reference hole with the reference pin; and removing the base substrate and the reference pin. ### Claim 10 (depends on 9) The method according to claim 9, wherein the number of reference pins provided on the substrate is at least two. ### Claim 11 (depends on 9) The method according to claim 9, wherein the reference pin is provided so as to be inserted into a hole formed in the substrate. ### Claim 12 (depends on 11) The method according to claim 11, wherein the reference pin is provided on a plate and the plate is closely adhered to a lower surface of the substrate, such that the reference pin is inserted into the hole formed in the substrate.