# US 2014/0151014 A1 · System and method for regulating temperature of electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0151014 A1 - Document ID: US20140151014A1 - Status: Published application - Kind: A1 - Application number: 13/808,460 - Filed: 2012-12-05 - Published: 2014-06-05 - Earliest claimed: 2012-12-05 - Assignees: Telefonaktiebolaget L M Ericsson (publ) - Applicants: Telefonaktiebolaget L M Ericsson (Publ) - Inventors: Yang Zhang - Web page: https://patentgrep.com/patent/US20140151014A1 ## CPC - H05K 7/20336: {Heat pipes, e.g. wicks or capillary pumps} - H10W 40/10: Arrangements for heating - H10W 40/73: for cooling by change of state - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The invention relates to a system for regulating temperature of an electronic component, the system comprising: a local heater for heating the electronic component; a heat pipe for cooling the electronic component; and a heat sink for dissipating heat from the heat pipe; wherein the electronic component is adhered to an end of the heat pipe, and the heat sink is adhered to another end of the heat pipe. The invention also relates to a method for regulating temperature of an electronic component by the system. ## Claims ### Claim 1 A system for regulating temperature of an electronic component, the system comprising a local heater for heating the electronic component; a heat pipe for cooling the electronic component; and a heat sink for dissipating heat from the heat pipe; wherein the electronic component is adhered to an end of the heat pipe, and the heat sink is adhered to another end of the heat pipe. ### Claim 2 (depends on 1) The system according to claim 1, wherein the size of the local heater is comparable with the size of the electronic component. ### Claim 3 (depends on 1) The system according to claim 1, wherein the middle part of the heat pipe in the longitudinal direction of the heat pipe is surrounded by a thermal insulation material. ### Claim 4 (depends on 1) The system according to claim 1, wherein the length of the middle part is between 1-15 cm for a wall of the heat pipe with a thickness of 0.5-1 mm. ### Claim 5 (depends on 1) The system according to claim 1, wherein the thermal conductivity factor of the thermal insulation material is lower than 0.1 W/m·K. ### Claim 6 (depends on 1) The system according to claim 1, wherein the thermal insulation material is air, extra-fine glass wool, polyethylene foamed plastics, expanded polystyrene or rock wool. ### Claim 7 (depends on 1) The system according to claim 1, wherein the heat pipe is embedded in a groove formed in the heat sink. ### Claim 8 (depends on 1) The system according to claim 1, wherein the working substance of the heat pipe is water, acetone, ammonia, ethanol, or wax. ### Claim 9 (depends on 1) The system according to claim 1, wherein a capillary structure is formed on the inner wall of the heat pipe. ### Claim 10 (depends on 1) The system according to claim 1, wherein the electronic component is surrounded by the local heater. ### Claim 11 (depends on 1) The system according to claim 1, wherein a thermal conductivity material is arranged between the local heater and the electronic component. ### Claim 12 (depends on 1) The system according to claim 1, wherein a thermal conductivity material is arranged between the electronic component (201) and the heat pipe (204). ### Claim 13 (depends on 1) The system according to claim 1, wherein the electronic component comprises several temperature-sensitive elements located near to each other. ### Claim 14 A method for regulating temperature of an electronic component by a system, wherein the system comprises a local heater for heating the electronic component; a heat pipe for cooling the electronic component; and a heat sink for dissipating heat from the heat pipe; the method comprising the steps of: adhering the electronic component to an end of the heat pipe, and adhering the heat sink to another end of the heat pipe; heating the electronic component with the local heater when the ambient temperature is lower than a first predetermined value; and dissipating heat from the electronic component with the heat pipe when the internal temperature is higher than a second predetermined value. ### Claim 15 (depends on 14) The method according to claim 14, wherein the first predetermined value is substantially equal to or lower than the freezing point of the working substance of the heat pipe. ### Claim 16 (depends on 1) The method according to claim 1, wherein the second predetermined value is substantially equal to the lowest operating temperature of the heat pipe. ### Claim 17 (depends on 1) The method according to claim 1, wherein the size of the local heater is comparable with the size of the electronic component. ### Claim 18 (depends on 1) The method according to claim 1, wherein the middle part of the heat pipe in the longitudinal direction of the heat pipe is surrounded by a thermal insulation material. ### Claim 19 (depends on 1) The method according to claim 1, wherein the length of the middle part is between 1-15 cm for a wall of the heat pipe with a thickness of 0.5-1 mm. ### Claim 20 (depends on 1) The method according to claim 1, wherein the thermal conductivity factor of the thermal insulation material is lower than 0.1 W/m·K. ### Claim 21 (depends on 1) The method according to claim 1, wherein the thermal insulation material is air, extra-fine glass wool, polyethylene foamed plastics, expanded polystyrene or rock wool. ### Claim 22 (depends on 1) The method according to claim 1, wherein the heat pipe is embedded in a groove formed in the heat sink. ### Claim 23 (depends on 1) The method according to claim 1, wherein the working substance of the heat pipe is water, acetone, ammonia, ethanol, or wax. ### Claim 24 (depends on 1) The method according to claim 1, wherein a capillary structure is formed on the inner wall of the heat pipe. ### Claim 25 (depends on 1) The method according to claim 1, wherein the electronic component is surrounded by the local heater. ### Claim 26 (depends on 1) The method according to claim 1, wherein a thermal conductivity material is arranged between the local heater and the electronic component. ### Claim 27 (depends on 1) The method according to claim 1, wherein a thermal conductivity material is arranged between the electronic component and the heat pipe. ### Claim 28 (depends on 1) The method according to claim 1, wherein the electronic component comprises several temperature-sensitive elements located near to each other.