# US 2014/0150996 A1 · Cooling device, and electronic apparatus with the cooling device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0150996 A1 - Document ID: US20140150996A1 - Status: Published application - Kind: A1 - Application number: 13/920,931 - Filed: 2013-06-18 - Published: 2014-06-05 - Earliest claimed: 2012-11-30 - Assignees: Kabushiki Kaisha Toshiba - Applicants: Kabushiki Kaisha Toshiba - Inventors: Yukihiko Hata - Web page: https://patentgrep.com/patent/US20140150996A1 ## CPC - F28D 15/0233: {the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence)} - F28D 15/0275: {Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores} - G06F 1/203: {for portable computers, e.g. for laptops} - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract According to one embodiment, a cooling device is provided with a heat receiving member connected to a heat generator, a heat pipe connected to the heat receiving member, a heat dissipation fin connected to the heat pipe at an opposite side of the heat receiving member, and a fan configured to cool the heat dissipation fin. The cooling device is also provided with a tank containing a liquid and thermally connected to the heat receiving member. ## Claims ### Claim 1 A cooling device comprising: a heat receiving member connected to a heat generator; a heat pipe connected to the heat receiving member; a heat dissipation fin connected to the heat pipe at an opposite side of the heat receiving member; a fan configured to cool the heat dissipation fin; and a tank containing a liquid and thermally connected to the heat receiving member. ### Claim 2 (depends on 1) The cooling device of claim 1, wherein when an end of the heat pipe connected to the heat receiving member is positioned gravitationally above another end of the heat pipe connected to the heat dissipation fin, the liquid in the tank overlaps with the heat receiving member. ### Claim 3 (depends on 2) The cooling device of claim 2, wherein when the end of the heat pipe connected to the heat receiving member is positioned gravitationally below the another end of the heat pipe connected to the heat dissipation fin, the liquid in the tank does not overlap with the heat receiving member. ### Claim 4 (depends on 1) The cooling device of claim 1, wherein the tank is located closer to a suction port of the fan than the heat pipe. ### Claim 5 (depends on 1) The cooling device of claim 1, wherein the heat pipe is angled in an L shape; and the tank is attached to the heat receiving member in a positional relationship in which the liquid in the tank does not overlap with the heat receiving member when a first portion of the heat pipe between the end of the heat pipe and an angled portion of the heat pipe extends vertically and the another end of the heat pipe connected to the fin is positioned gravitationally above the end of the heat pipe, and when a second portion between the angled portion of the heat pipe and the another end of the heat pipe extends vertically and the another end of the heat pipe is positioned gravitationally above the end of the heat pipe. ### Claim 6 (depends on 1) The cooling device of claim 1, wherein the tank is attached to the heat receiving member by solder. ### Claim 7 An electronic apparatus comprising: a housing with an exhaust port; a heat generator in the housing; and a cooling device attached to the heat generator, wherein the cooling device comprises: a heat receiving member connected to the heat generator; a heat pipe connected to the heat receiving member; a heat dissipation fin connected to the heat pipe at an opposite side of the heat receiving member, and opposing an inside of the exhaust port; a fan located near the exhaust port with the heat dissipation fin interposed therebetween, and configured to cool the heat dissipation fin; and a tank containing a liquid and thermally connected to the heat receiving member. ### Claim 8 (depends on 7) The electronic apparatus of claim 7, wherein when the housing assumes an attitude in which an end of the heat pipe connected to the heat receiving member is positioned gravitationally above another end of the heat pipe connected to the heat dissipation fin, the liquid in the tank overlaps with the heat receiving member. ### Claim 9 (depends on 7) The electronic apparatus of claim 7, wherein when the housing assumes an attitude in which the end of the heat pipe connected to the heat receiving member is positioned gravitationally below the another end of the heat pipe connected to the heat dissipation fin, the liquid in the tank does not overlap with the heat receiving member. ### Claim 10 (depends on 7) The electronic apparatus of claim 7, wherein the tank is located closer to a suction port of the fan than the heat pipe. ### Claim 11 (depends on 7) The electronic apparatus of claim 7, wherein the heat pipe is angled in an L shape; and the tank is attached to the heat receiving member in a positional relationship in which the liquid in the tank does not overlap with the heat receiving member when a first portion of the heat pipe between the end of the heat pipe and an angled portion of the heat pipe extends vertically and the another end of the heat pipe connected to the fin is positioned gravitationally above the end of the heat pipe, and when a second portion between the angled portion of the heat pipe and the another end of the heat pipe extends vertically and the another end of the heat pipe is positioned gravitationally above the end of the heat pipe. ### Claim 12 (depends on 7) The electronic apparatus of claim 7, wherein the tank is attached to the heat receiving member by solder.