# US 2014/0150973 A1 · Epoxy resin composition and manufacturing method of bonding structure

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- Number: US 2014/0150973 A1
- Document ID: US20140150973A1
- Status: Published application
- Kind: A1
- Application number: 14/095,122
- Filed: 2013-12-03
- Published: 2014-06-05
- Earliest claimed: 2012-12-05
- Assignees: Denso Corporation
- Applicants: Denso Corporation
- Inventors: Hiroyuki Okuhira; Akira Takakura; Hiroshi Katou
- Web page: https://patentgrep.com/patent/US20140150973A1

## CPC

- C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- B32B 37/1207: {Heat-activated adhesive (B32B37/04 takes precedence)}
- C08G 59/504: {containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen}
- C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)

## Abstract

An epoxy resin composition includes: epoxy resin as a main component; and diamine having phenylene oxide skeleton indicated by an equation of: A code of “X” is a hydrogen or a methyl group, and a suffix of “n” is an integer in a range between 1 and 10. In the above composition, the gelation time is short, compared with a case where the epoxy resin composition with using phenylene sulfide skeletal diamine as hardening agent of an epoxy resin.

## Claims

### Claim 1

An epoxy resin composition comprising:
epoxy resin as a main component; and
diamine having phenylene oxide skeleton indicated by an equation of:
wherein a code of “X” is a hydrogen or a methyl group, and
wherein a suffix of “n” is an integer in a range between 1 and 10.

### Claim 2 (depends on 1)

The epoxy resin composition according to claim 1,
wherein all of benzene rings are coupled at a para position.

### Claim 3 (depends on 1)

The epoxy resin composition according to claim 1,
wherein the suffix of “n” is three.

### Claim 4 (depends on 1)

The epoxy resin composition according to claim 1,
wherein the code of “X” is a hydrogen.

### Claim 5 (depends on 1)

The epoxy resin composition according to claim 1, further comprising:
elastomer as thermo plastic resin.

### Claim 6 (depends on 1)

A manufacturing method of a bonding structure comprising:
preparing the epoxy resin composition according to claim 1;
applying the epoxy resin composition to at least one of two adhering objects;
bonding two adhering objects;
placing bonded two adhering objects without moving; and
heating the epoxy resin composition so that the epoxy resin composition is hardened.

### Claim 7 (depends on 6)

The manufacturing method of the bonding structure according to claim 6,
wherein at least one of two adhering objects is made of poly phenylene sulfide.