# US 2014/0150972 A1 · Temporary adhesion of chemically similar substrates

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- Number: US 2014/0150972 A1
- Document ID: US20140150972A1
- Status: Published application
- Kind: A1
- Application number: 14/233,071
- Filed: 2012-07-11
- Published: 2014-06-05
- Earliest claimed: 2011-07-22
- Assignees: Wacker Chemie AG
- Inventors: Andreas Koellnberger; Frank Achenbach
- Web page: https://patentgrep.com/patent/US20140150972A1

## CPC

- B29C 65/76: Making non-permanent or releasable joints
- C09J 5/00: Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J 183/04: Polysiloxanes
- H10P 72/74: {using temporarily an auxiliary support}
- C08G 77/12: containing silicon bound to hydrogen
- C08G 77/20: containing silicon bound to unsaturated aliphatic groups
- C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors
- C09J 2301/502: process for debonding adherents
- C09J 2483/00: Presence of polysiloxane
- H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes}
- H10P 72/7412: {the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support}
- H10P 72/7416: {used during dicing or grinding}
- H10P 72/7422: {used to protect an active side of a device or wafer}
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS

## Abstract

A temporary adhesive for reversibly bonding a silicon wafer to a silicon support contains a crosslinkable organopolysiloxanes composition and a fatty acid or salt thereof or fatty acid ester as a release regulator having a density different from the crosslinkable organopolysiloxanes composition of at least 0.1 g/cm3, which upon parting of the wafer from the substrate, the adhesive remains substantially adhered to the substrate.

## Claims

### Claim at position 1

1-4. (canceled)

### Claim 5

A process for the temporary adhesive bonding of a silicon wafer to a silicon support, comprising applying an adhesive to the support, wherein
the adhesive is a crosslinkable silicone composition comprising at least 0.01 to 10 wt % of release agents selected from the group consisting of fatty acids and their metal salts, fatty acid esters of saturated or unsaturated fatty acids, or a combination thereof,
wherein the adhesion regulator (A) has at least a density difference of 0.10 g/cm3 as compared with the density of the silicone composition and as a result the adhesive force between the cured adhesive and the silicon support is greater by at least 0.5 N/mm than the adhesive force between the cured adhesive and the silicon wafer, measured according to DIN ISO 813, and the cured adhesive can be parted adhesively on at least 80% of the area only from the silicon wafer on parting of a bond between the silicon wafer and the silicon support.

### Claim 6 (depends on 5)

The process of claim 5, wherein the crosslinkable silicone composition is selected from the group consisting of condensation-crosslinking, addition-crosslinking, and peroxidically crosslinking silicone compositions.

### Claim 7

A method for the temporary adhesive bonding of a silicon wafer to a silicon support, comprising:
a) applying an adhesive to a silicon wafer, wherein the adhesive is a crosslinkable silicone composition comprising at least 0.01 to 10 wt % of release agents selected from the group consisting of fatty acids and their metal salts, fatty acid esters of saturated or unsaturated fatty acids, and combinations thereof,
wherein the adhesion regulator (A) has at least a density difference of 0.10 g/cm3 as compared with the density of the silicone composition and as a result the adhesive force between the cured adhesive and the silicon support is greater by at least 0.5 N/mm than the adhesive force between the cured adhesive and the silicon wafer, measured according to DIN ISO 813, and the cured adhesive can be parted adhesively on at least 80% of the area only from the silicon wafer on parting of a bond between the silicon wafer and the silicon support,
b) observing a waiting time of 10 seconds to 120 minutes wherein any solvent present is removed during the waiting time,
d) contacting the silicon support with the adhesive,
e) curing the adhesive,
f) implementing further working steps on the silicon wafer and/or the silicon support,
g) separating the silicon wafer and silicon support, with the cured adhesive remaining on the silicon support.

### Claim 8

A method for the temporary adhesive bonding of a silicon wafer to a silicon support, comprising:
a) applying an adhesive to a silicon wafer, wherein the adhesive is a crosslinkable silicone composition comprising at least 0.01 to 10 wt % of release agents selected from the group consisting of fatty acids and their metal salts, fatty acid esters of saturated or unsaturated fatty acids, and combinations thereof,
wherein the adhesion regulator (A) has at least a density difference of 0.10 g/cm3 as compared with the density of the silicone composition and as a result the adhesive force between the cured adhesive and the silicon support is greater by at least 0.5 N/mm than the adhesive force between the cured adhesive and the silicon wafer, measured according to DIN ISO 813, and the cured adhesive can be parted adhesively on at least 80% of the area only from the silicon wafer on parting of a bond between the silicon wafer and the silicon support,
b) observing a waiting time of 10 seconds to 120 minutes wherein any solvent present is removed during the waiting time,
d) contacting the silicon support with the adhesive,
e) curing the adhesive,
f) implementing further working steps on the silicon wafer and/or the silicon support,
g) separating the silicon wafer and silicon support, with the cured adhesive remaining on the silicon support,
wherein the crosslinkable silicone composition is selected from the group consisting of condensation-crosslinking, addition-crosslinking, and peroxidically crosslinking silicone compositions.