# US 2014/0150970 A1 · Structural adhesive compositions > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0150970 A1 - Document ID: US20140150970A1 - Status: Published application - Kind: A1 - Application number: 13/918,021 - Filed: 2013-06-14 - Published: 2014-06-05 - Earliest claimed: 2010-11-19 - Applicants: PPG Industries Ohio, Inc. - Inventors: Umesh C. Desai; Tien-Chieh Chao; Masayuki Nakajima; Kaliappa G. Ragunathan - Web page: https://patentgrep.com/patent/US20140150970A1 ## CPC - C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins - B82Y 30/00: Nanotechnology for materials or surface science, e.g. nanocomposites - C08G 59/066: {with chain extension or advancing agents} - C08G 59/182: {using pre-adducts of epoxy compounds with curing agents} - C08G 59/184: {with amines} - C08G 59/4276: {Polyesters} - C08G 59/5006: {aliphatic} - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - C09J 5/00: Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers - C09J 5/06: involving heating of the applied adhesive - C08K 3/04: Carbon - C08L 2205/02: containing two or more polymers of the same C08L -group - C09J 2463/00: Presence of epoxy resin - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) ## Abstract Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid. ## Claims ### Claim 1 A composition comprising: (a) an epoxy-capped flexibilizer; and (b) a heat-activated latent curing agent comprising a reaction product of reactants comprising (i) an epoxy compound, and (ii) an amine and/or an alkaloid. ### Claim 2 (depends on 1) The composition of claim 1, wherein the epoxy-capped flexibilizer comprises a reaction product of reactants comprising: (i) an epoxy compound; (iii) a polyol; and (iv) an anhydride and/or a diacid. ### Claim 3 (depends on 1) The composition of claim 1, wherein the epoxy-capped flexibilizer comprises a reaction product of reactants comprising: (i) an epoxy compound; (iii) a polyol; (iv) an anhydride; and (v) a diacid. ### Claim 4 (depends on 1) The composition of claim 1, wherein the epoxy-capped flexibilizer comprises a reaction product of reactants comprising: (i) an epoxy compound; (ii) an anhydride and/or a diacid; and (iii) a caprolactone. ### Claim 5 (depends on 1) The composition of claim 1, wherein the epoxy-capped flexibilizer comprises a reaction product of reactants comprising: (i) an epoxy compound; and (ii) a primary or secondary polyether amine. ### Claim 6 (depends on 1) The composition of claim 1, wherein the reactants comprise an amine. ### Claim 7 (depends on 1) The composition of claim 1, wherein the reactants comprise an alkaloid. ### Claim 8 (depends on 1) The composition of claim 1, wherein the reactants comprise an epoxy compound, an amine, and alkaloid. ### Claim 9 (depends on 1) The composition of claim 1, wherein the reactants comprise two epoxy compounds, an amine, and alkaloid. ### Claim 10 (depends on 1) The composition of claim 1, wherein the epoxy compound used as a reactant comprises Bisphenol A diglycidyl ether, phenyl diglycidyl ether, glycidyl methalcrylate, or combinations thereof. ### Claim 11 (depends on 1) The composition of claim 1, wherein the amine comprises secondary amine. ### Claim 12 (depends on 1) The composition of claim 1, wherein the amine comprises a dimethyl amine. ### Claim 13 (depends on 1) The composition of claim 1 wherein the alkaloid comprises a diazole. ### Claim 14 (depends on 1) The composition of claim 1 wherein the alkaloid comprises an imidazole. ### Claim 15 (depends on 1) The composition of claim 1 further comprising (c) graphenic carbon particles, rubber particles having a core/shell structure, an epoxy/CTBN adduct and/or an epoxy/dimer acid adduct. ### Claim 16 (depends on 1) The composition of claim 1 further comprising (c) dicyandiamine and/or 3,4-dichlorophenyl-N,N-dimethylurea. ### Claim 17 (depends on 1) The composition of claim 1, wherein the composition is curable at a temperature below 140° C. ### Claim 18 (depends on 1) The composition of claim 1, wherein the composition is heat-curable within 15 minutes or less. ### Claim 19 (depends on 1) A method of adhering articles comprising: (a) applying the composition of claim 1 to at least one of the articles; and (b) heating the composition at a temperature of less than 140° C. for a time of less than 15 minutes to cure the composition and thereby adhering the articles together. ### Claim 20 (depends on 1) The composition of claim 1, which, when applied at 1 mm thick to hot dipped galvanized metal with a bond area of 20 mm×10 mm×0.25 mm, and following heating, has a measured lap shear strength of at least 15 MPa when tested at room temperature.