# US 2014/0150839 A1 · Circuit assemblies including thermoelectric modules > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0150839 A1 - Document ID: US20140150839A1 - Status: Published application - Kind: A1 - Application number: 14/176,388 - Filed: 2014-02-10 - Published: 2014-06-05 - Earliest claimed: 2011-02-05 - Assignees: Laird Technologies, Inc. - Applicants: Laird Technologies, Inc. - Inventors: Jeffrey Gerard Hershberger; Richard F. Hill; Robert Michael Smythe; Michael G. Sutsko - Web page: https://patentgrep.com/patent/US20140150839A1 ## CPC - F25B 21/02: using Peltier effect; using Nernst-Ettinghausen effect - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 7/205: {Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] (details of PCBs relating to heat transfer H05K1/0201)} - H10N 10/13: characterised by the heat-exchanging means at the junction - H10N 10/17: characterised by the structure or configuration of the cell or thermocouple forming the device - H10W 40/28: comprising Peltier coolers - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 1/182: associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] - H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)} - H05K 2201/10219: Thermoelectric component - Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc. - F25B: REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module. ## Claims ### Claim 1 A circuit assembly comprising: a circuit board; a thermoelectric module; and at least one electrical pathway coupling the thermoelectric module to the circuit board; wherein the circuit board forms at least part of the thermoelectric module; and wherein the circuit board can support electrical components on the circuit board at locations spaced apart from the thermoelectric module. ### Claim 2 (depends on 1) The circuit assembly of claim 1, further comprising multiple thermoelectric modules, and wherein the circuit board forms at least part of the multiple thermoelectric modules. ### Claim 3 (depends on 2) The circuit assembly of claim 2, wherein the multiple thermoelectric modules are operable as electrical power generators in the circuit assembly. ### Claim 4 (depends on 1) The circuit assembly of claim 1, wherein the thermoelectric module includes: a substrate spaced apart from the circuit board; and multiple N-type thermoelectric elements and multiple P-type thermoelectric elements electrically coupled between the substrate and the circuit board. ### Claim 5 (depends on 1) The circuit assembly of claim 1, wherein the at least one electrical pathway comprises multiple groups of electrical pathways on the circuit board, each group configured to couple a different thermoelectric module to the circuit board. ### Claim 6 (depends on 1) The circuit assembly of claim 1, wherein the at least one electrical pathway is buried in the circuit board, and wherein the circuit board includes a base support, at least part of the base support being removed to thereby define an opening through the base support exposing the at least one electrical pathway of the circuit board, the at least one electrical pathway being configured to couple the thermoelectric module to the circuit board through the opening defined in the base support of the circuit board. ### Claim 7 (depends on 1) The circuit assembly of claim 1, wherein the at least one electrical pathway couples the thermoelectric module to the circuit board for use as a heat pump in the circuit assembly. ### Claim 8 (depends on 1) The circuit assembly of claim 1, wherein the at least one electrical pathway couples the thermoelectric module to the circuit board for use as a thermoelectric generator in the circuit assembly. ### Claim 9 (depends on 1) The circuit assembly of claim 1, wherein the circuit board operates as one of a hot side and a cold side of the thermoelectric module. ### Claim 10 (depends on 1) The circuit assembly of claim 1, wherein the thermoelectric module is disposed within a footprint of the circuit board, the circuit board being configured to support the electrical components within said footprint of the circuit board at locations spaced apart from the thermoelectric module. ### Claim 11 (depends on 1) The circuit assembly of claim 1, wherein the electrical components comprise at least one electrical component configured to control operation of the thermoelectric module, the at least one electrical component being disposed on the circuit board in a position spaced apart from the thermoelectric module. ### Claim 12 (depends on 1) The circuit assembly of claim 1, further comprising a heat transfer device coupled to the circuit board. ### Claim 13 (depends on 1) The circuit assembly of claim 1, wherein the at least one electrical pathway is on an exposed surface of the circuit board or is buried in the circuit board. ### Claim 14 (depends on 1) The circuit assembly of claim 1, wherein the at least one electrical pathway is disposed between two dielectric layers of the circuit board. ### Claim 15 (depends on 1) The circuit assembly of claim 1, wherein: the thermoelectric module is configured to transfer heat away from at least one of the electrical components through the circuit board when said at least one of the electrical components is coupled to the circuit board; and/or at least one of the electrical components is coupled to the circuit board and spaced apart from the thermoelectric module, the thermoelectric module being configured to transfer heat away from said at least one of the electrical components. ### Claim 16 A circuit assembly comprising: a circuit board; a thermoelectric module comprising: a first substrate defined by a portion of the circuit board; a second substrate disposed within a footprint of the circuit board; N-type and P-type thermoelectric elements disposed generally between the first and second substrates; at least one additional thermoelectric module coupled to the circuit board such that the circuit board defines part of the at least one additional thermoelectric module; wherein the circuit board can support at least one electrical component in a position spaced apart from the thermoelectric module. ### Claim 17 (depends on 16) The circuit assembly of claim 16, wherein the thermoelectric module is operable as a heat pump in the circuit assembly. ### Claim 18 (depends on 16) The circuit assembly of claim 16, wherein the thermoelectric module is operable as a thermoelectric generator in the circuit assembly. ### Claim 19 A circuit assembly comprising: a circuit board; a thermoelectric module comprising: a first substrate defined by a portion of the circuit board; a second substrate disposed within a footprint of the circuit board; N-type and P-type thermoelectric elements disposed generally between the first and second substrates; electrical pathways configured to couple the thermoelectric elements to the circuit board, the electrical pathways being buried in the circuit board; wherein the circuit board can support at least one electrical component in a position spaced apart from the thermoelectric module; wherein the circuit board includes a base support, at least part of the base support being removed to thereby define an opening through the base support exposing the electrical pathways, the electrical pathways being configured to couple the thermoelectric elements to the circuit board through the opening defined in the base support of the circuit board. ### Claim 20 (depends on 19) The circuit assembly of claim 19, wherein the thermoelectric module is operable as a heat pump in the circuit assembly. ### Claim 21 (depends on 19) The circuit assembly of claim 19, wherein the thermoelectric module is operable as a thermoelectric generator in the circuit assembly. ### Claim 22 A circuit assembly comprising: a circuit board comprising electrically conductive patterns and at least one electrical pathway; a substrate comprising electrically conductive patterns; and multiple N-type thermoelectric elements and multiple P-type thermoelectric elements disposed between the circuit board and the substrate and coupled to the electrically conductive patterns of the circuit board and the electrically conductive patterns of the substrate; wherein a portion of the circuit board comprising the electrically conductive patterns, the substrate, and the multiple N-type and P-type thermoelectric elements define a thermoelectric module on the circuit board, such that the circuit board forms an integral part of the thermoelectric module; wherein the at least one electrical pathway of the circuit board is coupled to the thermoelectric module; and wherein the circuit board can support at least one electrical component on the circuit board at a location spaced apart from the thermoelectric module. ### Claim 23 (depends on 22) The circuit assembly of claim 22, wherein the thermoelectric module is operable as a heat pump in the circuit assembly. ### Claim 24 (depends on 22) The circuit assembly of claim 22, wherein the thermoelectric module is operable as a thermoelectric generator in the circuit assembly.