# US 2014/0150766 A1 · Abrasive article and method of forming

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- Number: US 2014/0150766 A1
- Document ID: US20140150766A1
- Status: Published application
- Kind: A1
- Application number: 13/930,577
- Filed: 2013-06-28
- Published: 2014-06-05
- Earliest claimed: 2012-06-29
- Inventors: Wei Che; Avanti Jain; Christopher Arcona; Yinggang Tian; Paul W. Rehrig
- Web page: https://patentgrep.com/patent/US20140150766A1

## CPC

- B28D 5/045: {by cutting with wires or closed-loop blades (B28D5/042 takes precedence)}
- B24B 27/0633: {using a cutting wire}
- B28D 1/124: {Saw chains; rod-like saw blades; saw cables}
- C09K 3/1409: {Abrasive particles per se (preparation of diamond C01B32/25)}
- C09K 3/1445: {the coating consisting exclusively of metals}
- B28D: WORKING STONE OR STONE-LIKE MATERIALS
- B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE

## Abstract

A method of conducting a cutting operation on a workpiece including providing an abrasive article having a substrate having an elongated body, a tacking layer overlying the substrate, and a first type of abrasive particle contained in the tacking layer, the method further including moving the abrasive article and a workpiece relative to each other, the workpiece including a material selected from the group consisting of a ceramic, a semiconductive material, an insulating material, a glass, a natural material, organic material, and a combination thereof.

## Claims

### Claim at position 1

1-21. (canceled)

### Claim 22

A method of conducting a cutting operation on a workpiece comprising:
providing an abrasive article comprising:
a substrate having an elongated body;
a tacking layer overlying the substrate; and
a first type of abrasive particle contained in the tacking layer;
moving the abrasive article and a workpiece relative to each other, wherein the workpiece comprises a material selected from the group consisting of a ceramic, a semiconductive material, an insulating material, a glass, a natural material, organic material, and a combination thereof.

### Claim 23 (depends on 22)

The method of claim 22, wherein moving comprises using a reel-to-reel machine.

### Claim 24 (depends on 22)

The method of claim 22, wherein moving comprises reciprocating the abrasive article forward and backward.

### Claim 25 (depends on 22)

The method of claim 22, wherein moving comprises moving abrasive article and workpiece relative each other.

### Claim 26 (depends on 22)

The method of claim 22, wherein the workpiece comprises a material selected from the group consisting of oxides, carbides, nitrides, minerals, rocks, single crystalline materials, multi-crystalline materials, and a combination thereof.

### Claim 27 (depends on 22)

The method of claim 22, wherein the workpiece comprises a material selected from the group consisting of sapphire, quartz, silicon carbide, and a combination thereof.

### Claim 28 (depends on 22)

The method of claim 22, further comprising providing a coolant at an interface of the abrasive article and workpiece during moving.

### Claim 29 (depends on 28)

The method of claim 28, wherein the coolant comprises a water-based material, wherein the coolant comprises an oil-based material, wherein the coolant comprises a synthetic material.

### Claim 30 (depends on 22)

The method of claim 22, wherein moving includes a variable cycle operation.

### Claim 31 (depends on 30)

The method of claim 30, wherein the cycle is the elapsed time on moving the abrasive article forward and backward once at a variable wire speed, wherein the cycle time includes the elapsed time on accelerating the wire from 0 m/s to set wire speed in the forward direction, plus the elapsed time on moving the wire at set wire speed in the forward direction, plus the elapsed time on decelerating the wire from set wire speed to 0 m/s in the forward direction, plus the elapsed time on accelerating the wire from 0 m/s to set wire speed in the backward direction, plus the elapsed time on moving the wire at set wire speed in the backward direction, and plus the elapsed time on decelerating the wire from set wire speed to 0 m/s in the backward direction.

### Claim 32 (depends on 30)

The method of claim 30, wherein a variable cycle operation includes same or different cycle time while moving the wire and workpiece relative to each other

### Claim 33 (depends on 22)

The method of claim 22, wherein the VWSR range is at least about 1, wherein VWSR is the variable wire speed ratio, wherein the VWSR equal to t2/(t1+t3), wherein t2 is the elapsed time when the abrasive article moves forward or backward at a set wire speed, wherein t1 is the elapsed time when the abrasive article moves forward or backward from 0 wire speed to set wire speed, wherein t3 is the elapsed time when the abrasive article moves forward or backward from constant wire speed to 0 wire speed.

### Claim 34 (depends on 22)

The method of claim 22, wherein the workpiece comprises silicon.

### Claim 35 (depends on 34)

The method of claim 34, wherein moving comprises slicing of the workpiece comprising silicon into thin wafers, wherein the abrasive article has a life of at least about 8 m2/km, wherein m2/km is wafer area generated per kilometer of abrasive article used.

### Claim 36 (depends on 35)

The method of claim 35, wherein the abrasive article comprises a concentration of the first type of abrasive particle of at least about 1.0 carats per kilometer of substrate.

### Claim 37 (depends on 22)

The method of claim 22, wherein the workpiece comprises silicon, and wherein moving comprises squaring of the workpiece comprising silicon.

### Claim 38 (depends on 37)

The method of claim 37, wherein the abrasive article has a life of at least about 0.5 m2/km, wherein m2/km is wafer area generated per kilometer of abrasive article used.

### Claim 39 (depends on 37)

The method of claim 37, further comprising a first abrasive particle concentration of at least about 5 carats per kilometer of the substrate and not greater than about 300 carats per kilometer of substrate.

### Claim 40 (depends on 37)

The method of claim 37, wherein moving is conducted at a workpiece feed rate of at least about 1 mm/min.

### Claim 41 (depends on 22)

The method of claim 22, wherein the workpiece comprises sapphire, and wherein the sapphire consists of at least one of c-plane sapphire, a-plane sapphire, r-plane sapphire, and a combination thereof.