Method of manufacturing a circuit board
AssigneeIntel Corporation
InventorsDavid Shykind, James McCall
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a circuit board is described herein. The method may include adding a resin, forming first and second fiberglass fibers, and forming first and second signal line traces capable of transmitting electrical signals. In some examples, a ratio between fiberglass and resin material near the first signal line trace is similar to a ratio between fiberglass and resin material near the second signal line trace. In some examples, the first and second fiberglass fibers diagonally cross near the first and second signal line traces. In some examples, the first and second fiberglass fibers cross near the first and second signal line traces in a zig-zag pattern.
Claims9
1-21. (canceled)
A method of manufacturing a circuit board comprising:
- adding a resin;
- forming first and second fiberglass fibers;
- and
- forming first and second signal line traces capable of transmitting electrical signals;
- wherein a ratio between fiberglass and resin material near the first signal line trace is similar to a ratio between fiberglass and resin material near the second signal line trace, and a shape formed between the first and second signal line traces when crossing near the first and second fiberglass in a non-rectilinear shape.
Dependencies are inferred from the claim text.