# US 2014/0150255 A1 · Electronic Assembly

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- Number: US 2014/0150255 A1
- Document ID: US20140150255A1
- Status: Published application
- Kind: A1
- Application number: 14/176,150
- Filed: 2014-02-10
- Published: 2014-06-05
- Earliest claimed: 2011-02-10
- Inventors: Rodney Austin Green; Kevin Bellette; Perry Kelly
- Web page: https://patentgrep.com/patent/US20140150255A1

## CPC

- H05K 3/30: Assembling printed circuits with electric components, e.g. with resistors
- H05K 1/182: associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
- H05K 13/04: Mounting of components {, e.g. of leadless components}
- H05K 2201/09063: Holes or slots in insulating substrate not used for electrical connections
- H05K 2201/09645: Patterning on via walls; Plural lands around one hole
- H05K 2201/10583: Cylindrically shaped component; Fixing means therefore
- Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc.
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

An electronic assembly that includes a circuit board having a substrate in which an open space is defined, and a component having a housing and a plurality of leads, the open space being large enough to receive the housing of the component at least partially.

## Claims

### Claim 1

A method of mounting an electronic device onto a substrate so as to form part of an electronic assembly, said method comprising the steps of:
obtaining an electronic component having a disk-shaped, annular lead;
providing a cylindrical open space in the substrate, said open space being accessible through a circular opening in an outermost surface of said substrate, said open space having a diameter smaller than the diameter of said disk-shaped annular lead; and,
installing said electronic component into said cylindrical open space such that said circular opening is closed by said disk-shaped, annular lead.

### Claim 2 (depends on 1)

The method of claim 1 wherein said step of installing comprises the step of establishing electrical contact between a second lead on said electronic component and a connection pad on said substrate.

### Claim 3 (depends on 1)

The method of claim 1 wherein said cylindrical open space extends through said substrate.