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AssigneeKfm Technology
InventorsSebastien Brault, Elisabeth Dufour-Gergam, Fabrice Verjus, Martiel Desgeorges
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The invention relates to an electronic circuit (1) consisting of a substrate (10) having a surface on which at least one component (3) covered with a lid (22) is mounted. Said component comprises first connection means (15) to be connected to second connection means (70). In said circuit (1), at least one connection passage (50) is provided that extends through the lid in order to link the first connection means (15) to the outside of the lid, which then makes it possible to link the first means to the second connection means (70) (see FIG. 2). The invention can be used for the production of microsystems that require the encapsulation of some components.
Electronic circuit consisting of a substrate (10) with at least one face on which at least one component (3) is mounted with which first connection means (15) are linked, and at least one lid (22) having a thin structure resting on said substrate (10) in order to cover said component (3), characterized in that at least one connection passage (50) is provided in order to connect said first connection means (15) outside said lid (22).
Dependencies are inferred from the claim text.