Substrate processing apparatus, purging apparatus, method of manufacturing semiconductor device, and recording medium
AssigneeHitachi Kokusai Electric Inc.
InventorsMakoto HIRANO, Akinari HAYASHI
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Abstract
A substrate processing apparatus includes a processing vessel configured to process a substrate; a first purging part configured to perform a first purge to supply inert gas at a first flow rate into a substrate container accommodating the substrate; and a second purging part configured to perform a second purge to supply inert gas at a second flow rate into the substrate container, the second flow rate being lower than the first flow rate.
Claims15
A substrate processing apparatus comprising:
- a processing vessel configured to process a substrate;
- a first purging part configured to perform a first purge to supply inert gas at a first flow rate into a substrate container accommodating the substrate;
- and
- a second purging part configured to perform a second purge to supply inert gas at a second flow rate into the substrate container, the second flow rate being lower than the first flow rate.
A purging apparatus comprising:
- a first purging part configured to perform a first purge to supply inert gas at a first flow rate into a substrate container accommodating a substrate;
- and
- a second purging part configured to perform a second purge to supply inert gas at a second flow rate into the substrate container, the second flow rate being lower than the first flow rate.
A method of manufacturing a semiconductor device, comprising:
- performing a first purge in a first purging part to supply inert gas at a first flow rate into a substrate container accommodating a substrate;
- transferring the substrate container from the first purging part to a second purging part;
- and
- performing a second purge in the second purging part to supply inert gas at a second flow rate into the substrate container, the second flow rate being lower than the first flow rate.
A non-transitory computer-readable recording medium storing a program that causes a computer to perform a process comprising:
- performing a first purge in a first purging part to supply inert gas at a first flow rate into a substrate container accommodating a substrate;
- transferring the substrate container from the first purging part to a second purging part;
- and
- performing a second purge in the second purging part to supply inert gas at a second flow rate into the substrate container, the second flow rate being lower than the first flow rate.
Dependencies are inferred from the claim text.