Solder Alloy for Power Devices and Solder Joint Having a High Current Density
AssigneeSenju Metal Industry Co., Ltd.
InventorsHans-Jurgen Albrecht, Klaus Wilke, Katsuaki Suganuma, Minoru Ueshima
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Abstract
A solder joint which is used in power devices and the like and which can withstand a high current density without developing electromigration is formed of a Sn—Ag—Bi—In based alloy. The solder joint is formed of a solder alloy consisting essentially of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, and a remainder of Sn. The solder alloy may further contain at least one of Ni, Co, and Fe.
Claims7
1-6. (canceled)
A solder alloy for an electronic device having a joint carrying a current with a current density of 5-100 kA/cm2′ consisting of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, and a remainder of Sn.
A solder joint characterized by being made of a solder alloy consisting of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, and a remainder of Sn, wherein the solder joint is a solder joint inside an electronic device or a solder joint which is connected to an electronic device, and wherein a current with a current density of 5-1 00 kA/cm2 flows through at least a portion of the solder joint.
A power device characterized by having a solder joint inside the device made from a solder alloy consisting of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, and a remainder of Sn wherein a current density of 5-100 kA/cm2 flows through at least a portion of the joint.
Dependencies are inferred from the claim text.