Solderless mounting for semiconductor lasers
AssigneeSpectraSensors, Inc.
InventorsAlfred Feitisch, Gabi Neubauer, Mathias Schrempel
Life of this patent
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Abstract
A first contact surface of a semiconductor laser chip can be formed to a first target surface roughness and a second contact surface of a carrier mounting can be formed to a second target surface roughness. A first bond preparation layer comprising a first metal can optionally be applied to the formed first contact surface, and a second bond preparation layer comprising a second metal can optionally be applied to the formed second contact surface. The first contact surface can be contacted with the second contact surface, and a solderless securing process can secure the semiconductor laser chip to the carrier mounting. Related systems, methods, articles of manufacture, and the like are also described.
Claims55
A method comprising:
- forming a first contact surface of a semiconductor laser chip to a first target surface roughness and a second contact surface of a carrier mounting to a second target surface roughness;
- contacting the first contact surface with the second contact surface;
- and
- performing a solderless securing process to further secure the semiconductor laser chip to the carrier mounting.
An article of manufacture comprising:
- a first contact surface of a semiconductor laser chip formed to a first target surface roughness;
- a second contact surface of a carrier mounting formed to a second target surface roughness;
- an interface at which the first contact surface contacts the second contact surface, wherein the semiconductor laser chip is secured to the carrier mounting by a solderless attachment.
Dependencies are inferred from the claim text.