Heat sink for led light source
AssigneeUltravision Holdings, LLC
InventorDAVID SIUCHEONG AUYEUNG
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Abstract
A back panel for use in a light emitting diode (LED) lighting assembly is disclosed. An extruded substrate formed of a thermally conductive material is provided, the substrate having a plurality of fins extending from a first side of the substrate, each of the fins having a substantially rectangular shape oriented so that a longitudinal axis of the fin is substantially parallel to a longitudinal axis of the substrate. At least some of the fins include a hole formed through the fin to enable heated air to rise through the fins. A plurality of LEDs are mounted on a second side of the substrate, and oriented in a longitudinal orientation with the fins oriented parallel to the bottom edge of a surface to be illuminated, such that heat rises perpendicular to the surface of the fin.
Claims6
A back panel for use in a light emitting diode (LED) lighting assembly comprising:
- an extruded substrate formed of a thermally conductive material, the substrate having a plurality of fins extending from a first side of the substrate, each of the fins having a substantially rectangular shape oriented so that a longitudinal axis of the fin is substantially parallel to a longitudinal axis of the substrate, wherein at least some of the fins include a hole formed through the fin to enable heated air to rise through the fins, wherein a plurality of LEDs are mounted on a second side of the substrate, and oriented in a longitudinal orientation with the fins oriented parallel to the bottom edge of a surface to be illuminated, such that heat rises perpendicular to the surface of the fin.
The back panel of claim 6, and further comprising a mount to allow the surface of the substrate to have the angle thereof varied.
Dependencies are inferred from the claim text.