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US 2014/0111955 A1Published application
High efficiency embedding technology
AssigneeInfineon Technologies Austria AG
InventorMartin STANDING
Life of this patent
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Abstract
Representative implementations of devices and techniques provide improved electrical access to components, such as chip dice, for example, disposed within layers of a multi-layer printed circuit board (PCB). One or more insulating layers may be located on either side of a spacer layer containing the components. The insulating layers may have apertures strategically located to provide electrical connectivity between the components and conductive layers of the PCB.
Claims24
A multi-layer laminated printed circuit board (PCB), comprising:
- first and second conductive layers,
- first and second dielectric layers disposed between the first and second conductive layers, at least one of the first and second dielectric layers having one or more pre-formed apertures;
- a spacer layer disposed between the first and second dielectric layers, the spacer layer having one or more pre-formed apertures;
- and
- one or more electrical components disposed within the one or more pre-formed apertures of the spacer layer and electrically coupled to a portion of at least one of the first and second conductive layers via the one or more pre-formed apertures of the at least one of the first and second dielectric layers.
2 more elements
A method, comprising:
- forming a first dielectric film and a second dielectric film, at least one of the first and second dielectric films having one or more apertures;
- coating the first dielectric film with an adhesive, the adhesive filling any apertures in the first dielectric film;
- tacking the first dielectric film onto a first conductive sheet;
- forming a spacer having one or more apertures;
- tacking the spacer to the first dielectric film;
- bonding one or more electrical components into the one or more apertures in the spacer;
- coating the second dielectric film with the adhesive, the adhesive filling any apertures in the second dielectric film;
- tacking the second dielectric film to the dielectric spacer;
- tacking a second conductive sheet onto the second dielectric film;
- and
- laminating the first conductive sheet, the first dielectric film, the spacer, the one or more electrical components, the second dielectric film, and the second conductive sheet to form a laminated structure.
8 more elements
A method, comprising:
- depositing a first set of one or more forms onto a surface of a first conductive layer;
- depositing a first layer of dielectric material onto the first conductive layer, around the first set of one or more forms;
- depositing a spacer layer having one or more apertures onto the dielectric material and the one or more forms;
- and
- placing one or more electrical components into the one or more apertures in the spacer layer, the one or more electrical components arranged to be electrically coupled to a portion of the first conductive layer via one or more apertures formed in the first layer of dielectric material, based on the first set of one or more forms.
2 more elements
Dependencies are inferred from the claim text.