Heat dissipation structure for multilayer board and method of manufacturing the structure
AssigneeDenso Corporation
InventorsYoshimichi HARA, Toshihisa YAMAMOTO, Takahiro YAMANAKA, Kouji KAMEYAMA, Yuuji KOBAYASHI
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Abstract
A heat dissipation structure includes a multilayer board and a heat dissipator for dissipating heat generated in an electronic device incorporated in the multilayer board. The multilayer board has multiple base portions layered together and made of electrically insulating material. The base portion located between the electronic device and the heat dissipator has no interlayer connection conductor made of electrically conducting material and serves as an electrically insulating layer for providing electrical isolation between the electronic device and the heat dissipator.
Claims20
A heat dissipation structure comprising:
- a multilayer board having a first surface and a second surface opposite to the first surface in a layered direction;
- and
- a heat dissipator located on the first surface side of the multilayer board, wherein
- the multilayer board includes an electronic device, an electrically insulating layer, and a plurality of base portions made of electrically insulating material,
- the electronic device is incorporated in the plurality of base portions,
- the insulating layer and the plurality of base portions are layered together to form the multilayer board in such a manner that a first one of the plurality of base portions defines the first surface of the multilayer board and that the insulating layer defines the second surface of the multilayer board,
- each of the plurality of base portions has an interlayer connection conductor extending therethrough in the layered direction, the interlayer connection conductor being made of electrically conducting material and connected to the electronic device,
- at least one of the plurality of base portions has a conductive pattern connected to the interlayer connection conductor, and
- the insulating layer has no interlayer connection conductor and is located between the electronic device and the heat dissipator in the layered direction.
A method of manufacturing a heat dissipation structure for a multilayer board, the method comprising:
- a step of preparing an electrically insulating layer and a plurality of base portions made of electrically insulating material, the preparing step including forming a via hole in each of the plurality of base portions and filling the via hole with electrically conducting material, the preparing step further including forming a conductive pattern on at least one of the plurality of base portions;
- a step of incorporating an electronic device in the plurality of base portions;
- a step of layering the insulating layer and the plurality of base portions together in a layered direction to form a layered structure such that an outermost surface of the layered structure is defined by the insulating layer and such that the at least one of the plurality of base portions is located between the electronic device and the insulating layer;
- a step of applying heat and pressure to the layered structure by using a pressing machine so that the insulating layer and the plurality of base portions are bonded together into the multilayer board;
- and
- a step of mounting a heat dissipator on the insulating layer side of the multilayer board.
A method of manufacturing a heat dissipation structure for a multilayer board, the method comprising:
- a step of preparing an electrically insulating layer and a plurality of base portions made of electrically insulating material, the preparing step including forming a via hole in each of the plurality of base portions and filling the via hole with electrically conducting material, the preparing step further including forming a conductive pattern on at least one of the plurality of base portions;
- a step of incorporating an electronic device in the plurality of base portions;
- a step of layering the insulating layer and the plurality of base portions together in a layered direction to form a layered structure such that an outermost surface of the layered structure is defined by the insulating layer and such that the at least one of the plurality of base portions is located between the electronic device and the insulating layer;
- a step of arranging the layered structure between a circuit board and a heat dissipator in the layered direction in such a manner that the heat dissipator is located on the insulating layer side of the layered structure;
- and
- a step of applying heat and pressure to the layered structure through the circuit board and the heat dissipator by using a pressing machine.
Dependencies are inferred from the claim text.