Method for making paired lenses with an opaque barrier between, and product made
AssigneeStmicroelectronics Pte Ltd
InventorLaurent Herard
Life of this patent
Estimating the term…
Abstract
A method comprises depositing an optical filter layer on a glass wafer, then cutting the wafer into dice. The dice are positioned on a carrier and encapsulated in a molding compound to form a reconstituted wafer, and the wafer is back-ground and polished. Lens faces are positioned on opposing surfaces of the glass dice and spacers are positioned on one side of the wafer. The wafer is then cut into lens modules, each having two side-by-side lenses with an opaque molding compound barrier between. The individual modules are attached to devices that require dual lenses, such as, e.g., proximity sensors that use a light source and a light receiver or detector.
Claims16
A method, comprising:
- positioning a plurality of transparent dice on a carrier substrate;
- forming a reconstituted wafer with the plurality of transparent dice embedded in a molding compound layer, each of the plurality of transparent dice having a first face lying coplanar with a first face of the reconstituted wafer and a second face lying coplanar with a second face of the reconstituted wafer;
- positioning one of a first plurality of lens faces on a first face of each of the plurality of transparent dice;
- positioning one of a second plurality of lens faces on a second face of each of the plurality of transparent dice;
- and
- cutting the reconstituted wafer into a plurality of lens modules, each having two or more of a plurality of lenses, separated by a portion of the molding compound layer, each of the plurality of lenses including one of the plurality of transparent dice with one of the first plurality of lens faces on the first face of the respective one of the plurality of transparent dice and one of the second plurality of lens faces on the second face of the respective one of the plurality of transparent dice.
A method, comprising:
- forming a reconstituted wafer, including embedding a plurality of transparent glass dice in a layer of molding compound with first surfaces of each of the plurality of dice lying in a common plane with a first surface face of the layer of molding compound, and second surfaces of the plurality of dice lying in a common plane with a second surface of the layer of molding compound;
- positioning a first plurality of plastic lens faces on a first surface of the layer of molding compound, each of the first plurality of plastic lenses being positioned over the first surface of a respective one of the plurality of dice;
- positioning a second plurality of plastic lens faces on a second surface of the layer of molding compound, each of the second plurality of plastic lenses being positioned over the second surface of a respective one of the plurality of dice;
- cutting the reconstituted wafer into a plurality of lens modules, each having a pair of lenses embedded in a portion of the layer of molding compound.
A device, comprising:
- a plurality of lenses, each lens including a body having a first planar surface lying in a first plane with a first plastic lens face positioned on the first planar surface of the glass body, and a second planar surface lying in a second plane parallel to the first plane, with a second plastic lens face positioned on the second planar surface of the glass body;
- and
- a layer of molding compound material extending around and between the plurality of lenses, a first surface of the layer of molding compound material lying in the first plane, and a second surface of the layer of molding compound material lying in the second plane.
Dependencies are inferred from the claim text.