Method of overlay prediction

A method of forming a resist pattern, the method comprising:

• receiving a substrate having a material feature embedded in the substrate, wherein receiving the substrate includes receiving a first leveling data and a first overlay data generated when forming a first resist pattern associated with the material feature on the substrate;
• deposing a resist film on the substrate;
• and
• exposing the resist film according to a pattern using a predicted overlay correction data to form a second resist pattern overlying the material feature on the substrate, wherein using the predicted overlay correction data includes generating a second leveling data and calculating the predicted overlay correction data using the first leveling data, the first overlay data, and the second leveling data.

A method for patterning a substrate, the method comprising:

• exposing a first pattern on the substrate and obtaining a first leveling data;
• determining a first overlay data;
• processing the substrate with the first pattern;
• aligning the processed substrate with a second pattern and obtaining a second leveling data;
• predicting a second overlay data from the second leveling data and the first overlay data;
• exposing the second pattern on the substrate, using the second overlay data.