Camera module with lens holder and connecting plate both positioned on same substrate
AssigneesHon Hai Precision Industry Co., Ltd., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
InventorWEI CHEN
Life of this patent
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Abstract
A camera module includes a lens module and a connecting plate. The lens module includes a substrate and a lens holder. The substrate includes an upper surface. The upper surface includes a packaging area and a connecting area on the exterior of the packaging area. A number of first pads are positioned on the connecting area. The lens holder is positioned on the packaging area. A plurality of second pads is positioned on the connecting plate and corresponds to the first pads. The second pads of the connecting plate are electrically connected to the first pads of the substrate.
Claims10
A camera module, comprising:
- a lens module, comprising:
- a substrate comprising an upper surface, the upper surface comprising a packaging area and a connecting area on the exterior of the packaging area;
- the substrate comprising a plurality of first pads positioned on the connecting area;
- and
- a lens holder positioned on the packaging area;
- and
- a connecting plate comprising a plurality of second pads corresponding to the first pads, the second pads positioned on the connecting plate, the second pads of the connecting plate electrically connected to the first pads of the substrate.
A camera module, comprising:
- a lens module, comprising:
- a substrate comprising an upper surface, the upper surface comprising a packaging area and a connecting area on the exterior of the packaging area;
- the substrate comprising a plurality of first pads positioned on the connecting area;
- and
- an image sensor electrically positioned on the packaging area;
- a lens holder positioned on the packaging area and surrounding the image sensor;
- and
- a lens barrel received in the lens holder;
- and
- a connecting plate comprising a plurality of second pads corresponding to the first pads, the second pads positioned on the connecting plate, the second pads of the connecting plate electrically connected to the first pads of the substrate.
Dependencies are inferred from the claim text.