Waveguide coupler

A method comprising:

• forming a first metallization layer over the substrate such that the first metallization layer includes first and second circular patch antennas that are symmetrically aligned with one another;
• forming a second metallization layer over the first metallization layer, wherein the second metallization layer has first, second, and third portions, and wherein the first and second portions of the second metallization layer are in communication with the first and second patch antennas, respectively;
• forming a third metallization layer over the second metallization layer, wherein the third metallization layer has first, second, and third portions, and wherein the first, second, and third portions of the third metallization layer are in communication with the first, second, and third portions of the second metallization layer, respectively;
• and
• forming a fourth metallization layer over the third metallization layer, wherein the fourth metallization layer has first, second, and third portions, and wherein the first, second, and third portions of the fourth metallization layer are in communication with the first, second, and third portions of the third metallization layer, respectively, and wherein the first and second portions of the fourth metallization layer are located within a opening in the third portion of the fourth metallization layer that defines a window region, and wherein the first and second portions of the fourth metallization layer formed first and second elliptical patch antennas that are symmetrically aligned with one another.

An apparatus comprising:

• a circuit board;
• an IC;
• an antenna package having:
• a circuit trace assembly that is secured to the IC and the circuit board;
• a coupler that is secured to the circuit trace assembly, wherein the coupled includes:
• an antenna assembly having:
• a window region;
• an conductive that substantially surrounds the window region;
• a first circular patch antenna that is in communication with the IC;
• a second circular patch antenna that is in communication with the IC, wherein the first and second patch antennas are symmetrically aligned with one another;
• an first elliptical patch antenna that is located within the window region, that is extends over at least a portion of the first circular patch antenna, and that is in communication with the first circular patch antenna;
• and
• an second elliptical patch antenna that is located within the window region, that is extends over at least a portion of the second circular patch antenna, and that is in communication with the second circular patch antenna, and wherein the first and second elliptical patch antenna are symmetrically aligned with one another;
• and
• an HIS that substantially surrounds the antenna assembly;
• an alignment assembly that is secured to the coupler, wherein the alignment assembly includes an opening that is substantially aligned with the window region;
• and
• a waveguide that is secured to the alignment assembly.