Coupling arrangement
AssigneeHuawei Technologies Co., Ltd.
InventorsBengt Madeberg, Leif Bergstedt
Life of this patent
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Abstract
A coupling arrangement for the transfer of a microwave signal includes a motherboard having a first substrate with a first microstrip conductor, and a module having a second substrate with a second microstrip conductor. The module is attached to the motherboard such that the motherboard conductor by means of a connection is in electrical contact with the module conductor, whereby the microwave signal may be transferred between the motherboard conductor and the module conductor. The connection includes the motherboard conductor connected to a substrate integrated waveguide on the motherboard, which substrate integrated waveguide is connected to the module conductor via a slot coupling.
Claims11
A coupling arrangement for transfer of a microwave signal, the arrangement comprising:
- a motherboard comprising a substrate with a first microstrip conductor;
- a module comprising a substrate with a second microstrip conductor;
- wherein the module is attached to the motherboard such that the motherboard conductor by means of a connection is in electrical contact with the module conductor, whereby the microwave signal may be transferred between the motherboard conductor and the module conductor;
- and
- wherein the connection comprises the motherboard conductor connected to a substrate integrated waveguide on the motherboard, which substrate integrated waveguide is connected to the module conductor via a slot coupling.
Dependencies are inferred from the claim text.