Module and Coupling Arrangement

A coupling arrangement comprising:

• a motherboard;
• and
• a surface mount module connected to the motherboard,
• wherein the surface mount module comprises a substrate, a first microstrip conductor on a first side of the substrate, and a second microstrip conductor on a second, opposite side of the substrate,
• wherein the two conductors are connected with a connection through the surface mount module,
• wherein the connection comprises the first microstrip conductor being connected to a foil of electrically conducting material coated on the first side of the substrate,
• wherein the foil is surrounded by electrically conducting trenches running through the substrate from the first side to the second side of the substrate forming a substrate integrated waveguide, and
• wherein the trenches on the second side surrounds a second foil of electrically conducting material coated on the second side of the substrate and connected to the second microstrip conductor.
• wherein the motherboard comprises a substrate with a microstrip conductor,
• wherein the second conductor of the surface mount module is connected to the motherboard conductor,
• wherein a ground plane of the motherboard on an opposite side of the motherboard conductor is connected by a through connection to a ground patch on the same side as the motherboard conductor, and
• wherein the ground patch is connected with the trenches of the surface mount module.

An apparatus comprising:

• a motherboard;
• and
• a surface mount module connected to the motherboard,
• wherein the surface mount module comprises a substrate, a first microstrip conductor on a first side of the substrate, and a second microstrip conductor on a second, opposite side of the substrate,
• wherein the two conductors are connected with a connection through the surface mount module,
• wherein the connection comprises the first microstrip conductor being connected to a foil of electrically conducting material coated on the first side of the substrate,
• wherein the foil is surrounded by electrically conducting trenches running through the substrate from the first side to the second side of the substrate forming a substrate integrated waveguide, and
• wherein the trenches on the second side surrounds a second foil of electrically conducting material coated on the second side of the substrate and connected to the second microstrip conductor.