Inductor with conductive trace

An integrated circuit package comprising an inductor, comprising:

• an active device;
• a magnetic structure;
• a molding material formed around the magnetic structure;
• and
• a conductive trace formed around the magnetic structure, the conductive trace connected to the active device and comprising a first conductive pillar formed within the molding material, a height of the first conductive pillar substantially equal to a height of the magnetic structure.

A semiconductor device configured for electromagnetic induction, comprising:

• a magnetic structure;
• a molding material formed around the magnetic structure and comprising one or more conductive pillars, wherein at least one of:
• a top surface of the molding material and a top surface of the magnetic structure are substantially co-planar;
• or
• a bottom surface of the molding material and a bottom surface of the magnetic structure are substantially co-planar;
• an upper distribution structure formed on top of the molding material and the magnetic structure, the upper distribution structure comprising an upper interconnect connecting a first conductive pillar of the one or more conductive pillars to a second conductive pillar of the one or more conductive pillars, the second conductive pillar positioned on a diametrically opposite side of the magnetic structure relative to the first conductive pillar;
• and
• a lower distribution structure formed on a bottom of the molding material and the magnetic structure, the lower distribution structure comprising a lower interconnect connecting the first conductive pillar to a third conductive pillar of the one or more conductive pillars, the third conductive pillar positioned on the diametrically opposite side of the magnetic structure relative to the first conductive pillar.