Through-silicon via self-routing circuit and routing method thereof
AssigneeNational Changhua University of Education
InventorTsung-Chu HUANG
Life of this patent
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Abstract
A through-silicon via self-routing circuit includes a plurality of through-silicon vias (TSVs) and a plurality of planar die. The plurality of planar die are connected by the plurality of TSVs. And each one of the plurality of planar die includes a built-in self-tester, a built-in self-routing switching network, and a core circuit. The built-in self-tester has a plurality of valid-bit leads and a plurality of through-silicon via leads to connect the plurality of TSVs. The built-in self-routing switching network is connected to the built-in self-tester, for selecting from the plurality of TSVs for conducting. The core circuit has a to plurality of I/O leads linked to the built-in self-routing switching network.
Claims7
A through-silicon via self-routing circuit comprising:
- a plurality of through-silicon vias;
- and
- a plurality of planar die, connected by the plurality of through-silicon vias, each one of the plurality of planar die comprising:
- a built-in self-tester, having a plurality of valid-bit leads and a plurality of through-silicon via leads to connect the plurality of through-silicon vias;
- a built-in self-routing switching network, connected to the built-in self-tester, whereby the built-in self-routing switching network selects from the plurality of through-silicon vias for conducting;
- and
- a core circuit, having a plurality of I/O leads linked to the built-in self-routing switching network.
Dependencies are inferred from the claim text.