Transition delay detector for interconnect test
AssigneesTaiwan Semiconductor Manufacturing Company, Ltd., Imec
InventorsSandeep Kumar Goel, Erik Jan Marinissen
Life of this patent
Estimating the term…
Loading patent…
AssigneesTaiwan Semiconductor Manufacturing Company, Ltd., Imec
InventorsSandeep Kumar Goel, Erik Jan Marinissen
Estimating the term…
A test circuitry configured to test for transition delay defects in inter-die interconnects is disclosed. In one aspect, the test circuitry comprises an input port configured to receive a test data value and a data storage element configured to temporarily store the test data value. The test circuitry additionally comprises a second inter-die interconnect configured to be electrically connected to a first inter-die interconnect so as to form a feedback loop for transferring the test data value from the data storage element back to the data storage element. The test circuitry additionally comprises a data conditioner configured to condition the fed back test data value so as to make it distinguishable from the stored test data value. The test circuitry additionally comprises a clock pulse generator configured to generate a delayed clock pulse. The test circuitry additionally comprises a selection logic configured to apply the generated delayed clock pulse and the conditioned fed back test data value to the data storage element. The test circuitry further comprises a readout unit for reading out a test data value stored in the data storage element.
A test circuitry configured to test for transition delay defects in inter-die interconnects in a structure comprising a first die and a second die electrically connected to one another by at least a first inter-die interconnect, the test circuitry comprising:
A structure comprising a first die and a second die electrically connected to one another by at least a first inter-die interconnect, wherein at least one of the first die and the second die comprises:
A method of testing transition delay defects in inter-die interconnects in a structure comprising a first die and a second die electrically connected to one another by at least a first inter-die interconnect, the method comprising:
Dependencies are inferred from the claim text.