Method and apparatus for testing interconnection reliability of a ball grid array on a testing printed circuit board

A method of determining an electrical reliability of a ball grid array (BGA) assembly of an integrated circuit, comprising:

• stressing an integrated circuit (IC) package electrically connectable to a testing printed circuit board (PCB) by solder balls, said IC package having an IC die electrically connectable thereto by solder bumps, said testing PCB having IO and ground pads located on an underside thereof and within an IC test region, wherein each of said ground and IO pads is respectively, electrically connectable to a different pair of said solder balls and solder bumps;
• and
• testing an electrical continuity of said solder balls and solder bumps of said IC package after said IC package is stressed by applying a current through said IO to ground pads or through ground to ground pads connected to said different pairs of said solder balls and solder bumps.

An apparatus for determining an electrical reliability of a ball grid array (BGA) assembly of an integrated circuit, comprising:

• a testing printed circuit board (PCB) having an integrated circuit (IC) test region located thereon, vias extending through said testing PCB from a surface to an underside thereof within said IC test region, each via having an IO pad or ground pad electrically connectable thereto;
• an IC package having an IC die connected thereto by solder bumps and being connected to said IC test region by solder balls, such that each of said IO pads is electrically connectable to a respective pair of said solder balls and solder bumps by said vias.