Wafer Carrier Having Cavity
AssigneeSamsung Electronics Co., Ltd.
InventorsHo-Jin Lee, Pil-kyu Kang, Taeyeong Kim, Byung Lyul Park, Kyu-Ha Lee, Gilheyun Choi
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Abstract
A wafer carrier includes a base having a cavity provided at the center of the base and an outer sidewall extending along and away from an edge of the base to define the cavity. The cavity is configured to be filled with an adhesive layer. The wafer carrier is configured to be bonded to a wafer with an adhesive layer in the cavity of base such that the outer sidewall faces and is in contact with an edge of the wafer and the cavity faces a center of the wafer.
Claims20
A wafer carrier comprising:
- a base having a cavity configured to be filled with an adhesive layer, the cavity being provided at a center of the base;
- and
- an outer sidewall extending along and away from an edge of the base to define the cavity,
- wherein the wafer carrier is configured to be bonded to a wafer with an adhesive layer in the cavity of base such that the outer sidewall faces and is in contact with an edge of the wafer and the cavity faces a center of the wafer.
A wafer carrier configured to be bonded to a wafer by an adhesive layer, wherein the wafer carrier comprises:
- a cavity configured to be filled with the adhesive layer, the cavity configured to face a center of the wafer when the wafer carrier is bonded to the wafer;
- and
- an outer dam extending along an outer boundary of the cavity, the outer dam including at least one outer groove, the outer dam configured to face and contact an edge of the wafer such that the at least one outer groove provides an open path from the cavity to outside the wafer carrier when the wafer carrier is bonded to the wafer.
A wafer carrier comprising:
- a body including a base and an outer wall extending outwardly away from an edge of the base, the outer wall defining a cavity in the body, the outer wall including a plurality of gaps,
- wherein the wafer carrier is configured to be bonded to a wafer by an adhesive layer filling the cavity such that, when the wafer carrier is bonded to the wafer, the outer wall of the wafer carrier contacts the wafer and the gaps of the outer wall define a flow path for adhesive from the adhesive layer to flow from the cavity to outside the wafer carrier.
Dependencies are inferred from the claim text.