Method of manufacturing display device

A method for forming a display device, comprising:

• forming a pixel electrode on a first base substrate;
• forming a first main alignment layer on the first base substrate on which the pixel electrode is formed;
• forming a common electrode on a second base substrate disposed opposite to the first base substrate;
• forming a second main alignment layer on the second base substrate on which the common electrode is formed;
• forming a liquid crystal layer between the first and second main alignment layers, wherein the liquid crystal layer comprises a liquid crystal composition including a reactive mesogen;
• applying an electric field to the liquid crystal layer;
• firstly curing the reactive mesogen of the liquid crystal layer at a temperature from about −20° C. to about 60° C. while the electric field is being applied to the liquid crystal layer;
• and
• secondly curing the reactive mesogen of the liquid crystal layer without applying the electric field to the liquid crystal layer, thereby forming a first reactive mesogen layer disposed on the first main alignment layer and a second reactive mesogen layer disposed on the second main alignment layer,
• wherein the liquid crystal composition comprises the reactive mesogen in an amount exceeding 0 percent by weight and equal to or smaller than about 30 percent by weight relative to a total weight of the liquid crystal composition.

A method for forming a display device, comprising:

• forming a first initial alignment layer on a first base substrate, wherein the first initial alignment layer is a polymer layer including a first reactive mesogen;
• forming a second initial alignment layer on a second base substrate disposed opposite to the first base substrate, wherein the second initial alignment layer includes a second reactive mesogen;
• forming a liquid crystal layer between the first initial alignment layer and the second initial alignment layer, wherein the liquid crystal layer comprises a liquid crystal composition which does not include a reactive mesogen;
• applying an electric field to the first and second initial alignment layers;
• firstly curing the first and second initial alignment layers at a temperature from about −20° C. to about 60° C. while the electric field is being applied to the first and second initial alignment layers;
• and
• secondly curing the first and second initial alignment layers without applying the electric field to the first and second initial alignment layers, thereby forming a first reactive mesogen layer on the first base substrate and a second reactive mesogen layer on the second base substrate.