Substrate and Method for Cutting the Substrate
AssigneeShenzhen China Star Optoelectronics Technology Co., Ltd.
InventorHsin-Hua Chen
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Abstract
The present invention discloses a method for cutting a substrate. The method includes the steps of 1) creating a etching groove in the first surface of the first sheet and the third surface of the second sheet; 2) laminating the first and second sheets with the etching grooves aligned with each other; and 3) using a cutter to cut through the second surface of first sheet and the fourth surface of the second sheet along a preset set cutting line such that a crack extending vertically to the etching grooves so as to sever the first and second sheets. The present invention further discloses a substrate. By way of the foregoing, the taper and gradient along the cutting edge can be reduced.
Claims15
A method for cutting a substrate which is configured with a first sheet having a first surface and a second surface opposite to the first surface, and a second sheet having a third surface and a fourth surface opposite to the third surface, characterized in that the method includes the steps of:
- creating a triangular etching groove on the first surface of the first sheet, and the third surface of the second sheet;
- laminating the first and second sheets such that the triangular etching grooves are matched together;
- using a cutter to cut through the second surface of first sheet and the fourth surface of the second sheet along a preset set cutting line such that a crack extending vertically to the etching grooves so as to sever the first and second sheets;
- and
- wherein the triangular etching groove is created through laser.
A method for cutting a substrate which is configured with a first sheet having a first surface and a second surface opposite to the first surface, and a second sheet having a third surface and a fourth surface opposite to the third surface, characterized in that the method includes the steps of:
- creating an etching groove in the first surface of the first sheet and the third surface of the second sheet;
- laminating the first and second sheets with the etching grooves aligned with each other;
- and using a cutter to cut through the second surface of first sheet and the fourth surface of the second sheet along a preset set cutting line such that a crack extending vertically to the etching grooves so as to sever the first and second sheets.
A substrate configured with a first sheet having a first surface and a second surface opposite to the first surface, and a second sheet haying a third surface and a fourth surface opposite to the third surface, characterized in that a etching groove in the first surface of the first sheet and the third surface of the second sheet
Dependencies are inferred from the claim text.