Embedding thin chips in polymer
AssigneeMC10, Inc.
InventorsConor RAFFERTY, Mitul Dalal
Life of this patent
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Abstract
Systems and methods are provided for the embedding of thin chips. A well region is generated in a substrate that includes a conductive material disposed on a flexible polymer. The standoff well region can be generated by pattern the conductive material, where the thin chip is embedded in the standoff well region. A cavity can be generated in the polymer layer to form a polymer well region, where the thin chip is embedded in the polymer well region.
Claims66
An apparatus comprising:
- A) a substrate comprising a standoff well region, wherein:
- the substrate comprises a layer of a first conductive material disposed on a layer of a flexible polymer;
- and
- a patterned portion of the first conductive material comprises a standoff bordering a portion of exposed flexible polymer, thereby forming the standoff well region;
- and
- B) a thin chip disposed within the standoff well region on a portion of the exposed flexible polymer proximate to the standoff;
- wherein a height of the standoff is comparable to a height of the thin chip.
A method for embedding thin chips, the method comprising:
- A) providing a substrate comprising a standoff well region, wherein:
- the substrate comprises a layer of a first conductive material disposed on a layer of a flexible polymer;
- and
- at least a portion of the first conductive material is patterned to form a standoff bordering a portion of exposed flexible polymer, thereby forming the standoff well region;
- and
- B) disposing a thin chip on a portion of the exposed flexible polymer proximate to the standoff such that a height of the standoff is comparable to a height of the thin chip.
An apparatus comprising:
- A) a substrate comprising a polymer well region, wherein:
- the substrate comprises a layer of a flexible polymer disposed on a layer of a first conductive material;
- a cavity is formed in at least a portion of the flexible polymer to form at least one polymer wall bordering a portion of exposed first conductive material, thereby forming the polymer well region;
- and
- B) a thin chip disposed within the polymer well region on at least a portion of the exposed first conductive material proximate to the at least one polymer wall.
A method for embedding thin chips, the method comprising:
- A) providing a substrate comprising a polymer well region, the substrate comprising a layer of a flexible polymer and a layer of a first conductive material, the polymer well region comprising at least one polymer wall formed from a portion of the flexible polymer and a base region formed from at least a portion of the first conductive material;
- and
- B) disposing the thin chip within the polymer well region on a portion of the first conductive material proximate to the at least one polymer wall.
An apparatus comprising:
- A) a flexible substrate comprising a well region, the flexible substrate comprising a polyimide or a liquid crystal polymer, and the flexible substrate including a cavity forming a well region in the flexible substrate;
- B) a thin chip disposed within the well region, wherein a height of at least one polymer wall of the well region is comparable to a height of the thin chip;
- and
- C) a polymer adhesive material disposed in the well region in substantial contact with at least a portion of the thin chip.
Dependencies are inferred from the claim text.