Semiconductor dies with reduced area consumption
AssigneeGlobalfoundries Inc.
InventorsDaniel Richter, Frank Kuechenmeister
Life of this patent
Estimating the term…
Abstract
The width of scribe lines may be reduced in semiconductor devices by applying a process technique in which trenches may be formed first from the rear side on the basis of a required width of the corresponding trenches, while subsequently it may be cut into the substrate from the front side on the basis of a reduced thickness of the corresponding saw blades, thereby also enabling a reduction of the scribe line width. Furthermore, contamination of the front side, i.e., of the metallization system, may be reduced, for instance, by performing an optional intermediate cleaning process.
Claims15
A semiconductor device, comprising:
- a semiconductor chip comprising a substrate having a front side defining a front side width and a front side length, said substrate further having a rear side defining a rear side width and a rear side length, said front side width being greater than said rear side width;
- a metallization system formed above said front side and comprising a contact structure;
- and
- a package substrate electrically connected to said contact structure.
7-20. (canceled)
A semiconductor device, comprising:
- a semiconductor chip comprising a substrate having a front side defining a front side width and a front side length, said substrate further having a rear side defining a rear side width and a rear side length, wherein said front side width is greater greater than said rear side width and said front side length is greater than said rear side length;
- a metallization system formed above said front side and comprising a contact structure;
- and
- a package substrate electrically connected to said contact structure.
A semiconductor device, comprising:
- a semiconductor chip comprising a substrate having a front side defining a front side width and a front side length, said substrate further having a rear side defining a rear side width and a rear side length, wherein said front side width is greater than said rear side width and wherein said substrate has four sidewalls extending from said front side to said rear side, wherein each of said sidewalls has a stepped configuration when viewed in cross-section;
- a metallization system formed above said front side and comprising a contact structure;
- and
- a package substrate electrically connected to said contact structure.
Dependencies are inferred from the claim text.