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US 2014/0110836 A1Published application
Packaging Devices, Methods of Manufacture Thereof, and Packaging Methods
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTsung-Fu Tsai, Yu-Chang Lin, Ying Ching Shih, Wei-Min Wu, Yian-Liang Kuo, Chia-Wei Tu
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Abstract
Packaging devices, methods of manufacture thereof, and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging device includes a substrate including an integrated circuit die mounting region. An underfill material flow prevention feature is disposed around the integrated circuit die mounting region.
Claims20
A packaging device, comprising:
- a substrate including an integrated circuit die mounting region;
- and
- an underfill material flow prevention feature disposed around the integrated circuit die mounting region.
A method of manufacturing a packaging device, the method comprising:
- providing a substrate, the substrate including an integrated circuit die mounting region;
- and
- forming an underfill material flow prevention feature on the substrate around a perimeter of the integrated circuit die mounting region, wherein the underfill material flow prevention feature is adapted to prevent an underfill material disposed beneath an integrated circuit die disposed on the integrated circuit die mounting region from flowing past the underfill material flow prevention feature.
A method of packaging a semiconductor device, the method comprising:
- providing a packaging device, the packaging device comprising a substrate including an integrated circuit die mounting region and an underfill material flow prevention feature disposed around the integrated circuit die mounting region;
- mounting an integrated circuit die onto the integrated circuit die mounting region of the substrate;
- and
- dispensing an underfill material beneath the integrated circuit die, wherein the underfill material flow prevention feature prevents the underfill material from flowing past the underfill material flow prevention feature on the packaging device.
1 more element
Dependencies are inferred from the claim text.