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US 2014/0110835 A1Published application
Bump Package and Methods of Formation Thereof
AssigneeInfineon Technologies AG
InventorsMeng Tong Ong, Thiam Huat Lim, Kok Chai Goh
Life of this patent
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Abstract
In accordance with an embodiment of the present invention, a semiconductor package includes a semiconductor chip and a bump. The semiconductor chip has a contact pad on a major surface. The bump is disposed on the contact pad of the semiconductor chip. A solder layer is disposed on sidewalls of the bump.
Claims31
A semiconductor package comprising:
- a first semiconductor chip having a first contact pad on a first major surface;
- a first bump disposed on the first contact pad;
- and
- a first solder layer disposed on sidewalls of the first bump.
1 more element
A semiconductor device comprising:
- a semiconductor chip having a first contact pad on a first major surface and a second contact pad on a second major surface;
- a magnetic bump disposed on the first contact pad;
- and
- a non-magnetic bump disposed on the second contact pad.
1 more element
A method of forming a semiconductor package, the method comprising:
- forming a plurality of chips in a substrate, the substrate having a plurality of first contacts on a first major surface and a plurality of second contacts on a second major surface;
- providing a first bumpframe comprising a plurality of first bumps;
- attaching the first bumpframe with the first major surface of the substrate;
- and
- singulating the substrate to form individual units.
2 more elements
A method of forming a semiconductor package, the method comprising:
- forming a reconstituted wafer comprising a plurality of chips, the reconstituted wafer having a plurality of first contacts on a first major surface and a plurality of second contacts on a second major surface;
- providing a first bumpframe comprising a plurality of first bumps;
- providing a second bumpframe comprising a plurality of second bumps;
- attaching the first bumpframe with the first major surface of the reconstituted wafer;
- attaching the second bumpframe with the second major surface of the reconstituted wafer;
- and
- singulating the reconstituted wafer to form individual units.
4 more elements
Dependencies are inferred from the claim text.