Power module package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsDo Jae Yoo, Si Joong Yang
Life of this patent
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Abstract
Disclosed herein is a power module package. The power module package includes a substrate having one surface formed with a circuit pattern including a chip mounting pad and an external connection pad and the other surface; a semiconductor chip mounted on the chip mounting pad; and an external connection terminal having one terminal and the other terminal, the one terminal being connected to the external connection pad and the other terminal protruding to the outside, in which the external connection pad and the external connection terminal are bonded to each other by welding.
Claims9
A power module package, comprising:
- a substrate having one surface formed with a circuit pattern including a chip mounting pad and an external connection pad and the other surface;
- a semiconductor chip mounted on the chip mounting pad;
- and
- an external connection terminal having one terminal and the other terminal, the one terminal being connected to the external connection pad and the other terminal protruding to the outside,
- wherein the external connection pad and the external connection terminal are bonded to each other by welding.
Dependencies are inferred from the claim text.