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US 2014/0110830 A1Published application
Semiconductor package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJong Man Kim, Young Hoon Kwak, Chang Seob Hong, Soon Gyu Yim
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Abstract
Disclosed herein is a semiconductor package, including: a first heat radiating plate; a second heat radiating plate formed below the first heat radiating plate; a heat radiating lead formed above the first heat radiating plate and having both ends contacted with the second heat radiating plate; an insulating layer formed above the heat radiating lead; at least one power device formed above the insulating layer; and at least one control device formed above the insulating layer.
Claims11
A semiconductor package, comprising:
- a first heat radiating plate;
- a second heat radiating plate formed below the first heat radiating plate;
- a heat radiating lead formed above the first heat radiating plate and having both ends contacted with the second heat radiating plate;
- an insulating layer formed above the heat radiating lead;
- at least one power device formed above the insulating layer;
- and
- at least one control device formed above the insulating layer.
4 more elements
Dependencies are inferred from the claim text.