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US 2014/0110829 A1Published application
Module Comprising a Semiconductor Chip
AssigneeInfineon Technologies AG
InventorsRalf Otremba, Xaver Schloegel, Khai Huat Jeffrey Low, Chee Soon Law
Life of this patent
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Abstract
A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
Claims17
A semiconductor device comprising:
- a semiconductor chip having a first terminal contact surface and a second terminal contact surface;
- a leadframe on which the semiconductor chip is mounted, wherein the leadframe is made from a material on a basis of copper (Cu), wherein the leadframe comprises a first lead with a first contact surface and a second lead with a second contact surface;
- a bond wire made of a material on a basis of Cu bonded to the first terminal contact surface and the first contact surface;
- and
- a clip made of a material on a basis of Cu soldered to the second terminal contact surface and the second contact surface, wherein the first and second contact surfaces comprises the same material.
2 more elements
A semiconductor device comprising:
- a semiconductor chip having a first terminal contact surface and a second terminal contact surface;
- a leadframe on which the semiconductor chip is mounted, wherein the leadframe is made from a material on a basis of copper (Cu), wherein the leadframe comprises a first lead with a first contact surface and a second lead with a second contact surface;
- a bond wire made of a material on a basis of Cu bonded to the first terminal contact surface and the first contact surface;
- and
- a clip comprising a material other than Cu soldered to the second terminal contact surface and the second contact surface, wherein the first and second contact surfaces comprises the same material.
2 more elements
Dependencies are inferred from the claim text.