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US 2014/0110828 A1Published application
Semiconductor Packages and Methods of Formation Thereof
AssigneeInfineon Technologies Austria AG
InventorsRalf Otremba, Klaus Schiess, Chee Voon Tan
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Abstract
In accordance with an embodiment of the present invention, a semiconductor device includes a lead frame having a die paddle and a lead. A chip is disposed over the die paddle of the lead frame. The semiconductor device further includes a clip, which is disposed over the chip. The clip couples a pad on the chip to the lead of the lead frame. The clip also includes a heat sink.
Claims29
A semiconductor device comprising:
- a lead frame comprising a die paddle and a first lead;
- a chip disposed over the die paddle of the lead frame;
- and
- a clip disposed over the chip, the clip coupling a first pad on the chip to the first lead of the lead frame, the clip comprising a heat sink.
1 more element
A semiconductor device comprising:
- a lead frame comprising a die paddle and a first lead;
- a chip disposed over the die paddle of the lead frame;
- and
- a clip disposed over the chip, the clip coupled to the first lead and to a first pad of the chip, wherein the clip comprises a first portion having a first width, a second portion having a second width, a third portion having a third width, the second portion being above the first portion, the third portion being above the second portion.
1 more element
A method of forming a semiconductor device, the method comprising:
- forming a clip by structuring a base material;
- attaching the clip to a chip, the clip including a heat sink;
- and
- attaching the chip and the clip to a lead frame.
1 more element
Dependencies are inferred from the claim text.