Semiconductor device, imaging device, method of inspecting semiconductor substrate, and method of fabricating semiconductor device

A method of fabricating a semiconductor device, the method comprising:

• a process of forming a concave portion in a first connection surface of at least a first semiconductor substrate of the first semiconductor substrate having a first wiring layer in which wirings are disposed in a plurality of layers and a second semiconductor substrate having a second wiring layer in which wirings are disposed in a plurality of layers, the concave portion having an electrode which is electrically connected to a portion of the wirings of the first semiconductor substrate and is capable of being electrically connected to an outside therein, the first connection surface being connected to the second semiconductor substrate;
• a process of inspecting at least the first semiconductor substrate in which the concave portion is formed using an electrical signal acquired using a probe needle from the electrode in the inside of the concave portion in a wafer state;
• and
• a process of electrically connecting the first semiconductor substrate and the second semiconductor substrate to each other in a state in which the first connection surface of the first semiconductor substrate and a second connection surface of the second semiconductor substrate face each other.