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US 2014/0110807 A1Published application
Camera module
AssigneeLapis Semiconductor Co., Ltd.
InventorMasahiro UEKAWA
Life of this patent
Estimating the term…
Abstract
A camera module has a sensor chip including a sensor unit formed on a main surface around which sides are disposed. A lens chip is fixed to the sensor chip with a spacer unit and includes a lens unit corresponding to the sensor unit. A light shieldable layer covers a first side of the sensor chip and a side of the spacer unit. A first cutting surface includes a second side of the sensor chip and a side of the light shieldable layer on a same plane.
Claims10
A camera module comprising:
- a sensor chip including a sensor unit formed on a main surface around which sides are disposed, at least one of the sides being comprised of a first side and a second side;
- a lens chip which is fixed to the sensor chip with a spacer unit and includes a lens unit corresponding to the sensor unit;
- a light shieldable layer covering the first side of the sensor chip and a side of the spacer unit;
- and
- a first cutting surface including the second side of the sensor chip and a side of the tight shieldable layer on a same plane.
2 more elements
Dependencies are inferred from the claim text.