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US 2014/0110801 A1Published application
Packaging for semiconductor sensor devices and methods
AssigneeFreescale Semiconductor, Inc.
InventorLEO M. HIGGINS, III
Life of this patent
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Abstract
A pressure sensor includes a first housing having a cavity. The pressure sensor further includes a pressure sensing device attached to a bottom of the cavity. The pressure sensor further includes a layer of gel over the pressure sensing device. The pressure sensor further includes a baffle in contact with the gel to reduce movement of the gel.
Claims20
A pressure sensor, comprising:
- a first housing having a cavity;
- a pressure sensing device attached to a bottom of the cavity;
- a layer of gel over the pressure sensing device;
- and
- a baffle in contact with the gel to reduce movement of the gel.
2 more elements
A pressure sensor, comprising:
- a first housing having a cavity;
- a pressure sensing device attached to a bottom of the cavity;
- a layer of low modulus gel over the pressure sensing device and in the cavity;
- and
- moderating means for moderating movement of the gel.
2 more elements
A method, comprising:
- forming a pressure sensor device in a cavity;
- forming a layer of gel over the pressure sensor device, and
- contacting the gel with a baffle comprising one of group consisting of a structure that lies on a top surface of the gel and a structure that extends under the top surface of the gel.
Dependencies are inferred from the claim text.