US 2014/0110739 A1 · LED PACKAGE AND METHOD FOR FABRICATING THE SAME

Abstract

A light emitting diode (LED) package according to an exemplary embodiment of the present invention includes a base including a first lead terminal and a second lead terminal, an LED chip disposed on the base, a housing disposed on the base, the housing having a cavity in which the LED chip is disposed, and an encapsulation member having a side surface contacting the housing. The first lead terminal and the second lead terminal each have a first surface and a second surface opposite the first surface, and have an unbent form, respectively. The second surface is exposed to the outside of the LED package.

Claims28

Dependent claims

A light emitting diode (LED) package, comprising:

a base comprising a first lead terminal and a second lead terminal;
an LED chip disposed on the base;
a housing disposed on the base, the housing comprising a cavity in which the LED chip is disposed;
and
an encapsulation member comprising a side surface contacting the housing,
wherein the first lead terminal and the second lead terminal each comprise a first surface and a second surface opposite the first surface, and have an unbent form, respectively,
wherein the second surface is exposed to the outside of the LED package.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application

14/142,071Filed 27 Dec 2013

Priority

KR 10-2007-01264366 Dec 2007

Published

24 Apr 2014

Term ends

Not estimatedThe source records don’t support an estimate.

Classification14 codes

H10H 20/853
Encapsulations: characterised by their shape
H10H 20/8506
Packages: containers
H10H 20/856
Optical field-shaping means, e.g. lenses: reflecting means
H10H 20/857
Packages: interconnections, e.g. lead-frames, bond wires or solder balls

Led package and method for fabricating the same

Life of this patent

Led package and method for fabricating the same

Life of this patent

Abstract

Claims28