Process of making a structure for encapsulating led chips and the led chips encapsulation structure

A process of making a structure for encapsulating a plurality of LED chips, the process comprising the steps of:

• (a) punching a reflective substrate into a reflective layer including a plurality of first through holes arranged as rows of reflective cups;
• (b) punching an insulating substrate into an insulating layer including a plurality of second through holes arranged in rows, a sheet-like flexible member having top and bottom surfaces formed with top and bottom layers of thermosetting plastic material respectively, and top and bottom coatings formed on the top and bottom layers of thermosetting plastic material respectively;
• (c) punching a conductive substrate to form a plurality of conductive members arranged in rows wherein each conductive member includes a solder pad and a spaced lead leg;
• (d) mechanically roughening a bottom of the reflective layer to form a rough surface thereon;
• (e) mechanically roughening a top of the conductive substrate to form a rough surface thereon;
• (f) filling an insulating material around the solder pads and the lead legs to form a lead frame;
• (g) removing the top and bottom coatings of the insulating layer;
• (h) stacking the reflective layer, the insulating layer, and the lead frame;
• (i) heating the reflective layer, the insulating layer, and the lead frame for melting the top and bottom layers of thermosetting plastic material;
• (i) fastening the reflective layer, the insulating layer, and the lead frame fastened together by the top and bottom layers of thermosetting plastic material after cooling;
• and
• (j) electroplating the fastened reflective layer, the insulating layer, and the lead frame to form an airtight radiation emitting coating on top and bottom surfaces thereon, thereby forming an LED chips encapsulation structure.