Stacked chip module with integrated circuit chips having integratable built-in self-maintenance blocks

A stacked chip module comprising a stack of integrated circuit chips, each of said integrated circuit chips in said stack comprising:

• a functional block on a substrate;
• a self-maintenance block on said substrate, said self-maintenance block comprising:
• a first controller controlling servicing of said functional block during wafer-level servicing and during module-level servicing;
• and
• a second controller providing an interface between an off-chip tester and said first controller during said wafer-level servicing;
• and
• a plurality of multiplexers and through-substrate-vias on said substrate and integrating said self-maintenance block with any adjacent self-maintenance blocks of any adjacent integrated circuit chips in said stack such that, during said module-level servicing, a single second controller on a bottom integrated circuit chip in said stack provides an interface between said off-chip tester and each first controller on each of said integrated circuit chips in said stack.

A stacked chip module manufacturing and servicing method comprising:

• manufacturing integrated circuit chips to be incorporated into a stacked chip module;
• performing wafer-level servicing of a functional block of each integrated circuit chip, said performing of said wafer-level servicing comprising:
• controlling, by a first controller of a self-maintenance block on said integrated circuit chip, servicing of said functional block;
• and
• providing, by a second controller of said self-maintenance block on said integrated circuit chip, an interface between an off-chip tester and said first controller;
• after said wafer-level servicing, packaging said integrated circuit chips into said stacked chip module, said packaging comprising arranging said integrated circuit chips in a stack and integrating said self-maintenance block on each integrated circuit chip with any adjacent self-maintenance blocks of any adjacent integrated circuit chips in said stack using a plurality of interconnect structures;
• and
• performing module-level servicing of functional blocks on said integrated circuit chips in said stack such that, during said module-level servicing, a single second controller on a single integrated circuit chip in said stack provides an interface between said off-chip tester and each first controller on each of said integrated circuit chips in said stack.

A stacked chip module manufacturing and servicing method comprising:

• manufacturing integrated circuit chips to be incorporated into a stacked chip module;
• performing wafer-level servicing of a functional block of each integrated circuit chip, said performing of said wafer-level servicing comprising:
• controlling, by a first controller of a self-maintenance block on said integrated circuit chip, servicing of said functional block;
• and
• providing, by a second controller of said self-maintenance block on said integrated circuit chip, an interface between an off-chip tester and said first controller;
• after said wafer-level servicing, packaging said integrated circuit chips into said stacked chip module, said packaging comprising arranging said integrated circuit chips into a stack and integrating said self-maintenance block on each integrated circuit chip with any adjacent self-maintenance blocks of any adjacent integrated circuit chips in said stack using a plurality of multiplexers and through-substrate-vias;
• and
• performing module-level servicing of functional blocks on said integrated circuit chips in said stack such that, during said module-level servicing, a single second controller on a bottom integrated circuit chip in said stack provides an interface between said off-chip tester and each first controller on each of said integrated circuit chips in said stack.