Stacked chip module with integrated circuit chips having integratable and reconfigurable built-in self-maintenance blocks

A stacked chip module comprising a stack of integrated circuit chips, each of said integrated circuit chips in said stack comprising:

• a functional block;
• a self-maintenance block comprising:
• built-in self-maintenance circuitry servicing said functional block, said servicing comprising wafer-level servicing and module-level servicing;
• a first controller and a second controller for said built-in self-maintenance circuitry;
• first reconfiguration circuitry in communication with said first controller and said built-in self-maintenance circuitry;
• and
• second reconfiguration circuitry in communication with said first controller and said second controller;
• a plurality of first interconnect structures electrically connecting said first reconfiguration circuitry to any adjacent first reconfiguration circuitry of any adjacent integrated circuit chips in said stack so as to allow said first reconfiguration circuitry to automatically and selectively enable one of said first controller and another first controller on another one of said integrated circuit chips in said stack to control said servicing of said functional block by said built-in self-maintenance circuitry during said module-level servicing;
• and
• a plurality of second interconnect structures electrically connecting said second reconfiguration circuitry to any adjacent second reconfiguration circuitry of any adjacent integrated circuit chips in said stack so as to allow said second reconfiguration circuitry to automatically and selectively enable one of said second controller and another second controller on another one of said integrated circuit chips in said stack to provide signal buffering to said first controller during said module-level servicing.

A stacked chip module manufacturing and servicing method comprising:

• manufacturing integrated circuit chips to be incorporated into a stacked chip module, each of said integrated circuit chips in said stack comprising:
• a functional block;
• a self-maintenance block comprising:
• built-in self-maintenance circuitry servicing said functional block, said servicing comprising wafer-level servicing and module-level servicing;
• a controller for said built-in self-maintenance circuitry;
• reconfiguration circuitry in communication with said controller;
• and
• a plurality of interconnect structures electrically connected to said reconfiguration circuitry;
• performing wafer-level servicing of said functional block on each of said integrated circuit chips using said built-in self-maintenance circuitry and said controller for said built-in self-maintenance circuitry;
• packaging said integrated circuit chips into a stacked chip module by arranging said integrated circuit chips in a stack and, on each integrated circuit chip in said stack, using said interconnect structures to electrically connect said reconfiguration circuitry to any adjacent reconfiguration circuitry of any adjacent integrated circuit chips in said stack;
• and,
• performing module-level servicing of said functional block on each of said integrated circuit chips, said performing of said module-level servicing comprising automatically and selectively enabling, by said reconfiguration circuitry, one of said controller and another controller on another one of said integrated circuit chips in said stack to operate in conjunction with said built-in self-maintenance circuitry.

A method of manufacturing and servicing a stacked chip module, said method comprising:

• manufacturing integrated circuit chips to be incorporated into a stacked chip module, each of said integrated circuit chips comprising:
• a functional block;
• a self-maintenance block comprising:
• built-in self-maintenance circuitry servicing said functional block, said servicing comprising wafer-level servicing and module-level servicing;
• a first controller and a second controller for said built-in self-maintenance circuitry;
• first reconfiguration circuitry in communication with said first controller and said built-in self-maintenance circuitry;
• and
• second reconfiguration circuitry in communication with said first controller and said second controller;
• a plurality of first interconnect structures electrically connected to said first reconfiguration circuitry;
• and
• a plurality of second interconnect structures electrically connected to said second reconfiguration circuitry;
• performing wafer-level servicing of said functional block on each of said integrated circuit chips using said first controller to control servicing of said functional block by said built-in self-maintenance circuitry and said second controller to provide signal buffering to said first controller;
• packaging said integrated circuit chips into a stacked chip module by arranging said integrated circuit chips in a stack and, on each integrated circuit chip in said stack, using said first interconnect structures to electrically connect said first reconfiguration circuitry to any adjacent first reconfiguration circuitry of any adjacent integrated circuit chips in said stack and further using said second interconnect structures to electrically connect said second reconfiguration circuitry to any adjacent second reconfiguration circuitry of any adjacent integrated circuit chips in said stack;
• and,
• performing module-level servicing of said functional block on each of said integrated circuit chips, said performing of said module-level servicing comprising, on each of said integrated circuit chips,
• automatically and selectively enabling, by said first reconfiguration circuitry, one of said first controller and another first controller on another one of said integrated circuit chips in said stack to control said servicing of said functional block by said built-in self-maintenance circuitry;
• and
• automatically and selectively enabling, by said second reconfiguration circuitry, one of said second controller and another second controller on another one of said integrated circuit chips in said stack to provide said signal buffering.