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US 2014/0110699 A1Published application
Adhesive film
AssigneeLG Chem, Ltd.
InventorsYoon Gyung Cho, Hyun Jee Yoo, Seung Min Lee, Suk Ky Chang, Jung Sup Shim
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Abstract
An adhesive film used to encapsulate an organic electronic diode (OED) is provided. The adhesive film may be useful in effectively preventing penetration of moisture into an encapsulated structure of the organic electronic diode when the organic electronic diode is encapsulated, and effectively performing the encapsulation process under moderate conditions without causing damage to the organic electronic diode during the encapsulation process.
Claims27
An adhesive film for encapsulating an organic electronic device, comprising:
- a first adhesive layer comprising a moisture-absorbent filler;
- and
- a second adhesive layer which does not comprise the moisture-absorbent filler,
- wherein a ratio T1/T2 of a thickness T2 of the second adhesive layer to a thickness T1 of the first adhesive layer is in the range from 1.0 to 10.
1 more element
Dependencies are inferred from the claim text.