Method for preparing desiccant layer, oled display panel and method for packaging the same
AssigneeBoe Technology Group Co., Ltd.
InventorsRui Hong, Joo Hyeon Lee, Dong Hwan Kim
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Abstract
A method for packaging an organic light emitting diode display panel, comprising providing a desiccant layer on a package cover plate. The desiccant layer is capable of effectively absorbing water and oxygen permeating, edges of the package cover plate and a substrate are hermetically coupled, and the desiccant layer and a device on the substrate are enclosed in a packaging cavity. This method can improve the packaging efficiency of the organic light emitting diode display panel and reduces production costs.
Claims12
An organic light emitting diode (OLED) display panel, comprising:
- a substrate and a device disposed on the substrate;
- a package cover plate, hermetically coupled to edges of the substrate so as to form a package cavity for packaging the device;
- and
- a desiccant layer disposed on a side of the package cover plate facing the package cavity and for drying the device.
A method for packaging an organic light emitting diode (OLED) display panel, comprising:
- providing a desiccant layer on a package cover plate that is for drying a device on a substrate;
- hermetically coupling edges of the package cover plate and the substrate, and sealing the desiccant layer and the device on the substrate within a package cavity formed by the package cover plate and the substrate.
Dependencies are inferred from the claim text.