Soldering system of soldering a dip component on a circuit board

A soldering system for direct insertion process, comprising:

• a track for transmitting a circuit board, at least one DIP component piercing through the circuit board;
• a laying device disposed on a first section of the track for laying fluxer on the circuit board;
• a boiler disposed on a second section of the track for providing molten tin to flow between the DIP component and the circuit board through a first surface of the circuit board when the first surface of the circuit board is passing through the boiler;
• a shelter, at least one hole being formed on the shelter, and a shape and a dimension of the at least one hole on the shelter corresponding to a shape and a dimension of the DIP component;
• a transmission roller disposed on a side of the shelter for rotating the shelter according to a transmission speed of the track;
• a position sensor disposed on a side of the track for detecting a position of the circuit board relative to the boiler;
• a thermal radiation heating device disposed on the second section of the track and opposite to the boiler, the shelter being disposed between the thermal radiation heating device and the circuit board, the thermal radiation heating device being for heating an area on a second surface of the circuit board different from the first surface adjacent to the DIP component through the at least one hole on the shelter continuously, so as to increase a temperature of the second surface when the first surface of the circuit board is passing through the boiler and the molten tin from the boiler is flowing between the DIP component and the circuit board through the first surface of the circuit board, to make the temperature of the second surface of the circuit board be substantially equal to a temperature of the first surface of the circuit board so that the molten tin from the boiler goes deeply into a gap between the DIP component and the circuit board before the molten tin is solidified;
• and
• a driving device electrically connected to the position sensor for driving the transmission roller to rotate the shelter and for moving the shelter and the thermal radiation heating device relative to the circuit board according to a detecting result of the position sensor, wherein a rotary speed of the shelter corresponds to a conveying speed of the circuit board conveyed by the track so that the at least one hole on the shelter continuously aims at the area on the second surface different from the first surface of the circuit board adjacent to the DIP component.